1. Catalogs
  2. DELO Industrial Adhesives
  3. Smart Bonds in RFID Technology

Smart Bonds in RFID Technology
1 /8Pages

Smart Bonds in RFID Technology

Smart Bonds in RFID Technology
1 /8Pages

Catalog excerpts

Smart Bonds in RFID Technology-1

Smart label Smart Bonds in RFID Technology

 Open the catalog to page 1
Smart Bonds in RFID Technology-2

Smart label Ask the experts DELO is the world leader in RFID adhesive solutions. Our adhesives can be found in two out of three RFID labels used in the world today. Customers rely on us as a partner who can understand and assist them during the entire process. Regardless of the material or chip design, reliable connection of the chip to the antenna is essential for the function of any RFID transponder. The correct adhesive and choice of process parameters can have a dramatic impact on the performance and reliability in your RFID application. Our engineers have extensive experience that shortens...

 Open the catalog to page 2
Smart Bonds in RFID Technology-3

adhesives manufacturer We are an adhesives manufacturer, but we go a step further as a custom service provider – helping you making your processes more efficient and giving you an edge over your competition. Our strong and extensive network in this application field allows us to support you in your current and future challenges. Every day new substrates, chip designs, and production processes enter the market. DELO’s corporate structure is specifically designed to enable rapid development of custom solutions for your individual application. This ensures the fastest time-to-market, and allows you...

 Open the catalog to page 3
Smart Bonds in RFID Technology-4

Flip-chip process Dispensing Chip placing We go with you every step of the way! Analysis Our adhesives are configured for HF, UHF, or LF tags, as well as for a great variety of substrates, chips, and placing machines. Customers can select from a wide range of standard adhesives, or if needed, we can modify them to meet specific requirements. We offer you all of our adhesive laboratory expertise. We will run all the tests necessary for the specific application, from dispensing to reliability testing. Designing and implementing an adhesive process for RFID production is a complex matter. Many parameters...

 Open the catalog to page 4
Smart Bonds in RFID Technology-5

Curing Inspection With our lab expertise we are able to advise you with parameters for dispensing and curing like: Reliability testing is critical to the success of your product. DELO has the capabilities to help you understand exactly how your product will perform by simulating the life cycle of a RFID label through: Pressure Needle diameter Jetting parameters Curing temperature Curing time Bonding force  Climatic storage (e. g., temperature humidity testing, temperature shock testing)  Mechanical stress (e. g., bonding)  Performance tests (e. g., read range, Q-value, ...) Read range after...

 Open the catalog to page 5
Smart Bonds in RFID Technology-6

Thermode station for flip-chip bonding After detailed lab testing, we test the adhesive in the actual application at your facility. Our specially trained engineers work globally and go on-site to help you implement our products in your processes. We provide ongoing personal support during the entire project: We  Adjust the adhesive for the specific machines  Conduct extensive tests on dispensing, placing and curing  Assist you in your production ramp-up Selecting the adhesive Optimization for the substrates and materials used Laboratory and on-site testing Integration in the actual production...

 Open the catalog to page 6
Smart Bonds in RFID Technology-7

* specific sales product PU = packing unit Delivery Storage Mechanical values Properties, Curing General Product RFID Chip Attach Adhesives | Material Selection Guide Application Product group Product code Operational area Reliability, output Basis Color Viscosity [mPas] Water absorption [%] Curing min max Heat curing with thermode Young’s modulus [MPa] at +25 °C DMTA Glass transition temp. Tg [°C] DMTA Coefficient °f linearbe|QW Tg expansion [ppm / K] above Tg St°rage |ife at room temp. at -18 °C Min. order quantity per delivery Available container sizes Halogen-free according to IEC 61249-2-21...

 Open the catalog to page 7
Smart Bonds in RFID Technology-8

DELO Industrial Adhesives Headquarters ► Germany • Windach / Munich . China • Shanghai Japan • Yokohama Malaysia • Kuala Lumpur Singapore South Korea • Seoul Taiwan • Taipei Thailand • Bangkok USA • Sudbury, MA www.DELO-adhesives.com The data and information provided are based on tests performed under laboratory conditions. Reliable information about the behavior of the product under practical conditions and its suitability for a specific purpose cannot be concluded from this. It is the customer's responsibility to test the suitability of a product for the intended purpose by considering all...

 Open the catalog to page 8
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.