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Potting Compounds and Encapsulants

Potting Compounds and Encapsulants
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Potting Compounds and Encapsulants

Product catalog summary
Overview
This document serves as a comprehensive guide on potting compounds and encapsulants, focusing on their role in protecting electronic components. It highlights various adhesives offered by DELO, tailored for different industrial applications, and details their specifications, curing processes, and benefits.
Specifications and Product Features
Potting compounds are categorized into rigid and permanently flexible types, suitable for applications like dam & fill, partial encapsulation, and large-volume potting. Key product groups include DELO MONOPOX, DELO DUALBOND, DELO-DUOPOX, DELO KATIOBOND, and DELO PHOTOBOND, each offering features such as high reliability, temperature resistance, and fast curing times.
Application Areas
These compounds are utilized in sectors such as automotive, power electronics, consumer electronics, and medical technology. Applications include sensor encapsulation, protection of electronic circuit carriers, and sealing of microswitches and plugs.
Curing Processes
The document describes curing methods like UV, heat, and dual-curing, with times ranging from seconds to minutes. Selecting the right curing process is crucial for optimizing production efficiency.
Performance Parameters
Important metrics include temperature of continuous use, coefficient of linear expansion, glass transition temperature, Young’s modulus, and elongation at tear, which help assess a compound's suitability for specific conditions.
Customer Benefits
DELO's products offer high media resistance, low outgassing, and RoHS compliance. They are designed for easy processing and economic packaging, suitable for both manual and automated production.
Conclusion
DELO provides a range of high-tech adhesives for diverse industrial needs, ensuring reliable component protection under extreme conditions. The document guides the selection of appropriate potting compounds or encapsulants based on application requirements.
DELOLUX LED Lamps Overview
The document also discusses DELOLUX LED lamps, highlighting their high energy efficiency and extended service life of over 20,000 hours. These lamps are optimized for curing by adjusting wavelengths to match adhesive properties, offering cost-efficient production processes.
Product Specifications
The DELOLUX series includes models like DELOLUX 80, DELOLUX 20, DELOLUX 202, and DELOLUX 820, each designed for specific applications with varying light exit areas and wavelengths.
Technical Details
Lamps operate at wavelengths of 365 nm, 400 nm, and 460 nm, with intensities from 250 mW/cm² to 5,500 mW/cm². Intensity measurement reliability is ensured with DELOLUXcontrol.
Applications and Recommendations
The document advises testing product suitability under practical conditions, as laboratory conditions may differ. Customers should consider specific requirements and apply relevant standards.
Legal and Copyright Information
A disclaimer notes the limitations of the data provided, emphasizing no guarantee of specific product properties. It also outlines copyright protection and the need for DELO's consent for reproduction or dissemination.
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Catalog excerpts

Potting Compounds and Encapsulants-1

Reliable Protection of Components The perfect adhesive for any potting or encapsulation Potting Compounds and Encapsulants

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Potting Compounds and Encapsulants-2

The Perfect Product for Your Potting or Encapsulation Project Rigid potting compounds and enca Application focus Dam & fill, glob top Partial encapsulation Full encapsulation Large-volume potting Application example (encapsulants represented in magenta in all illustrations) Number of components / chemical basis Curing heat, light fixation optional Product group DELO MONOPOX DELO DUALBOND Product features high reliability excellent media and temperature resistance high reliability long processing time at room temperature Temperature of continuous use [°C] Min. curing temperature [°C] +100 resp....

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Potting Compounds and Encapsulants-3

DELO offers high-tech adhesives tailored to meet the specific needs of any industrial application. Our wide range of products allows us to satisfy any requirement. Light-curing, heat-curing, or dual-curing, soft or hard, transparent or black – DELO has the ideal adhesive for any potting and encapsulation process. Dr. Karl Bitzer, Head of Product Management Permanently flexible potting compounds and encapsulants light and / or heat room temperature, heat optional light and / or heat light, light and heat, or light and humidity DELO KATIOBOND DELO DUALBOND DELO MONOPOX DELO KATIOBOND DELO DUALBOND...

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Potting Compounds and Encapsulants-4

Dam & fill (top) and glob top (below) for full and partial encapsulation Heat-curing Encapsulants for Chips and Sensors Unique combination of high reliability and outstanding processing properties It is essential that electronic components, such as chips and sensors, work properly in the most diverse fields of application, even under extreme conditions. Sensors used, for example, to check the oil level or pressure must be highly resistant to aggressive media and elevated temperatures. Specifically for such applications, we have developed encapsulants based on anhydride- curing epoxy resins, featuring...

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Potting Compounds and Encapsulants-5

Dam stacking without intermediate curing: Stable dam before and during heat curing. Curing of dam and fill in one step Temperature of use ranging from – 65 to +250 °C Very good temperature resistance and temperature stability Very good bond strength High temperature resistance up to +250 °C Large-area encapsulation without warpage Encapsulant lasts and protects up to +250 °C Light fixation in seconds Fast and reliable processes: Fixation within seconds, easy handling of the fixed components, final curing by heat (e. g. 30 min at +150 °C) Defined, highly accurate encapsulation in tiny spaces (no...

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Potting Compounds and Encapsulants-6

Encapsulation of a pressure sensor (TMAP) for the automotive industry Heat-curing Compounds for Large-scale Encapsulation Safe and reliable protection of sensors The automotive sector, in particular, makes high demands on encapsulants regarding excellent resistance to media such as petrol, diesel or oil as well as to temperatures. The two-component heat-curing DELO-DUOPOX CR types (CR = Casting Resin) clearly meet these r equirements and stand out with excellent flow roperties p and rapid curing in an air convection oven as well as simple logistics. Application areas Customer’s benefits Sensors,...

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Potting Compounds and Encapsulants-7

Dam & fill: The highly viscous dam material surrounds the low-viscous fill material Light-curing Chip Encapsulants Defined encapsulation to protect electronic components The light-fixable one-component epoxy resins are p rimarily used when bonded or encapsulated omponents c are exposed to extreme temperatures and aggressive m edia. Brief light fixation enables greater bonding a ccuracy, a defined fillet, and easier handling of the fixed components. Glob top encapsulation dditionally allows a “freezing the shape”, since the skin formed prevents the compound from flowing during ubsequent heat curing....

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Potting Compounds and Encapsulants-8

Encapsulation of electronic circuit carriers to protect its individual components Flexible Compounds for Large-volume Encapsulation Simple processing at room temperature DELO-DUOPOX two-component encapsulants distinguish themselves by easy processing, energy-efficient curing, and simple logistics. Different hardener systems provide diverse product properties. Application areas Customer’s benefits Sensors, e. g. for the automotive industry General industrial electric and electronic products Machinery and equipment industry Simple, economic processing at room temperature Flexible processing options:...

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Potting Compounds and Encapsulants-9

Fixing and encapsulating of Hall sensors in cars Encapsulation of Sensors Fixation within seconds for rapid further processing DELO KATIOBOND and DELO DUALBOND, the flexible and light-fixable one-component epoxy resins, protect sensors and other electronic components reliably against thermal influences, media, and vibrations, while still e nabling cycle times < 10 s. Application areas Customer’s benefits Sensor encapsulation, e. g. Hall sensor (see figure) Sealing of sensors Encapsulation of control electronics or other electronic components Short cycle times thanks to light fixation within s...

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Potting Compounds and Encapsulants-10

Plugs: Reliable pin sealing Microswitches: Pin sealing Microswitches: Pushbutton sealing, bonding of housings, pin sealing Sealing of Switches and Plugs Curing within seconds ensures short cycle times DELO PHOTOBOND and DELO DUALBOND, the light-curing one-component acrylates, guarantee reliable sealing of microswitches and plugs, fixation of electronic components, and bonding of housing parts. Fast bonding processes combining short cycle times and reliable process control are particularly important for a pplications in the automotive sector. Application areas Product properties Sensors Microswitches...

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Potting Compounds and Encapsulants-11

Curing of a glob top encapsulant with DELOLUX 80 Curing within Seconds with DELOLUX DELOLUX LED lamps are the leading technology when it comes to fast curing and allow optimal adjustment to the adhesive used. They have a high energy efficiency and can achieve a service life of more than 20,000 hours, which is significantly higher than that of conventional d ischarge lamps. For optimal curing, the wavelengths are adjusted to the adhesive properties. The lamps stand out for their low power consumption and allow the lamp p ower to be set individually. All these additional features guarantee cost-efficient...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.