Potting Compounds and Encapsulants
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Catalog excerpts

Potting Compounds and Encapsulants - 1

Reliable Protection of Components The perfect adhesive for any potting or encapsulation Potting Compounds and Encapsulants

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Potting Compounds and Encapsulants - 2

The Perfect Product for Your Potting or Encapsulation Project Rigid potting compounds and enca Application focus Dam & fill, glob top Partial encapsulation Full encapsulation Large-volume potting Application example (encapsulants represented in magenta in all illustrations) Number of components / chemical basis Curing heat, light fixation optional Product group DELO MONOPOX DELO DUALBOND Product features high reliability excellent media and temperature resistance high reliability long processing time at room temperature Temperature of continuous use [°C] Min. curing temperature [°C] +100...

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Potting Compounds and Encapsulants - 3

DELO offers high-tech adhesives tailored to meet the specific needs of any industrial application. Our wide range of products allows us to satisfy any requirement. Light-curing, heat-curing, or dual-curing, soft or hard, transparent or black – DELO has the ideal adhesive for any potting and encapsulation process. Dr. Karl Bitzer, Head of Product Management Permanently flexible potting compounds and encapsulants light and / or heat room temperature, heat optional light and / or heat light, light and heat, or light and humidity DELO KATIOBOND DELO DUALBOND DELO MONOPOX DELO KATIOBOND DELO...

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Potting Compounds and Encapsulants - 4

Dam & fill (top) and glob top (below) for full and partial encapsulation Heat-curing Encapsulants for Chips and Sensors Unique combination of high reliability and outstanding processing properties It is essential that electronic components, such as chips and sensors, work properly in the most diverse fields of application, even under extreme conditions. Sensors used, for example, to check the oil level or pressure must be highly resistant to aggressive media and elevated temperatures. Specifically for such applications, we have developed encapsulants based on anhydride- curing epoxy resins,...

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Potting Compounds and Encapsulants - 5

Dam stacking without intermediate curing: Stable dam before and during heat curing. Curing of dam and fill in one step Temperature of use ranging from – 65 to +250 °C Very good temperature resistance and temperature stability Very good bond strength High temperature resistance up to +250 °C Large-area encapsulation without warpage Encapsulant lasts and protects up to +250 °C Light fixation in seconds Fast and reliable processes: Fixation within seconds, easy handling of the fixed components, final curing by heat (e. g. 30 min at +150 °C) Defined, highly accurate encapsulation in tiny spaces...

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Potting Compounds and Encapsulants - 6

Encapsulation of a pressure sensor (TMAP) for the automotive industry Heat-curing Compounds for Large-scale Encapsulation Safe and reliable protection of sensors The automotive sector, in particular, makes high demands on encapsulants regarding excellent resistance to media such as petrol, diesel or oil as well as to temperatures. The two-component heat-curing DELO-DUOPOX CR types (CR = Casting Resin) clearly meet these r equirements and stand out with excellent flow roperties p and rapid curing in an air convection oven as well as simple logistics. Application areas Customer’s benefits...

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Potting Compounds and Encapsulants - 7

Dam & fill: The highly viscous dam material surrounds the low-viscous fill material Light-curing Chip Encapsulants Defined encapsulation to protect electronic components The light-fixable one-component epoxy resins are p rimarily used when bonded or encapsulated omponents c are exposed to extreme temperatures and aggressive m edia. Brief light fixation enables greater bonding a ccuracy, a defined fillet, and easier handling of the fixed components. Glob top encapsulation dditionally allows a “freezing the shape”, since the skin formed prevents the compound from flowing during ubsequent heat...

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Potting Compounds and Encapsulants - 8

Encapsulation of electronic circuit carriers to protect its individual components Flexible Compounds for Large-volume Encapsulation Simple processing at room temperature DELO-DUOPOX two-component encapsulants distinguish themselves by easy processing, energy-efficient curing, and simple logistics. Different hardener systems provide diverse product properties. Application areas Customer’s benefits Sensors, e. g. for the automotive industry General industrial electric and electronic products Machinery and equipment industry Simple, economic processing at room temperature Flexible processing...

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Potting Compounds and Encapsulants - 9

Fixing and encapsulating of Hall sensors in cars Encapsulation of Sensors Fixation within seconds for rapid further processing DELO KATIOBOND and DELO DUALBOND, the flexible and light-fixable one-component epoxy resins, protect sensors and other electronic components reliably against thermal influences, media, and vibrations, while still e nabling cycle times < 10 s. Application areas Customer’s benefits Sensor encapsulation, e. g. Hall sensor (see figure) Sealing of sensors Encapsulation of control electronics or other electronic components Short cycle times thanks to light fixation within...

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Potting Compounds and Encapsulants - 10

Plugs: Reliable pin sealing Microswitches: Pin sealing Microswitches: Pushbutton sealing, bonding of housings, pin sealing Sealing of Switches and Plugs Curing within seconds ensures short cycle times DELO PHOTOBOND and DELO DUALBOND, the light-curing one-component acrylates, guarantee reliable sealing of microswitches and plugs, fixation of electronic components, and bonding of housing parts. Fast bonding processes combining short cycle times and reliable process control are particularly important for a pplications in the automotive sector. Application areas Product properties Sensors...

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Potting Compounds and Encapsulants - 11

Curing of a glob top encapsulant with DELOLUX 80 Curing within Seconds with DELOLUX DELOLUX LED lamps are the leading technology when it comes to fast curing and allow optimal adjustment to the adhesive used. They have a high energy efficiency and can achieve a service life of more than 20,000 hours, which is significantly higher than that of conventional d ischarge lamps. For optimal curing, the wavelengths are adjusted to the adhesive properties. The lamps stand out for their low power consumption and allow the lamp p ower to be set individually. All these additional features guarantee...

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