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Adhesive and Process Solutions for LED Packaging

Adhesive and Process Solutions for LED Packaging

Adhesive and Process Solutions for LED Packaging

Product catalog summary
Adhesive and Process Solutions for LED Packaging
Introduction
LED technology is pivotal in modern lighting design, offering sustainable and versatile options for various sectors, including automotive and building technology. Adhesives are crucial in LED package design and manufacturing, ensuring long-lasting functionality and uniform brightness.
Adhesive Types and Applications
DELO has developed specialized adhesives for both first-level and second-level packaging. First-level packaging involves adhesives near the LED semiconductor, while second-level packaging focuses on bonding lenses and housing. These adhesives meet high standards and are tested globally.
Benefits of LED Adhesives
  • High optical quality and intensity.
  • Cost-efficient production through light curing.
  • Design flexibility with invisible joining.
DELO DUALBOND Features
  • Long-lasting LED intensity with minimal outgassing.
  • Yellowing-resistant and high-temperature resistance.
  • Swift processes with easy integration into production.
  • Optically clear and halogen-free options available.
First-Level Packaging
Adhesives in this category must withstand high temperatures and LED radiation. DELO DUALBOND adhesives offer temperature and light resistance with low outgassing. They provide reliable curing through a combination of light and heat.
Second-Level Packaging
Adhesives for joining lenses and housing must equalize tensions due to temperature changes. DELO PHOTOBOND series offers light-curing adhesives that are humidity, vibration, and temperature-resistant.
Flip-Chip Technology
Flip-chip LEDs, using anisotropic conductive adhesives, eliminate the need for wire bonds, allowing for smaller LED chips and flexible substrate use. DELO MONOPOX AC series ensures permanent contact and high processing rates.
Conclusion
DELO provides a range of adhesives tailored for LED packaging, ensuring high performance and reliability in various applications. Their products are tested under laboratory conditions to ensure consistent quality and performance.
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Catalog excerpts

Adhesive and Process Solutions for LED Packaging-1

Adhesive and Process Solutions for LED Packaging

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Adhesive and Process Solutions for LED Packaging-2

Bonding LED packages Adhesives for new lighting concepts LED technology stands for sustainable modern lighting design. Manufacturers make the most of the infinite design options offered by LEDs to develop versatile, innovative lighting concepts for building technology and lighting engineering in the automotive sector. Adhesives play a key role in the design and manufacture of LED packages. They are indispensable to the longlasting function and uniform brightness of the diodes and permit production in the space of a second. The prerequisite however is that the adhesives are precisely tailored to...

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Adhesive and Process Solutions for LED Packaging-3

2b Optional prefixation with DELOLUX 50 2a Placement of the lens or reflector First level packaging LED-compatible adhesives Adhesives and other materials in the immediate vicinity of the LED semiconductor are generally exposed to considerable stressing by high temperatures and LED radiation. In addition, neither the materials themselves, nor potential outgassing elements may be allowed to negatively interact with the LED. Above all, adhesives based on densely crosslinked epoxies, like DELO DUALBOND adhesives, have proved their worth in these applications. They not only offer temperature and light...

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Adhesive and Process Solutions for LED Packaging-4

Lens shear test Polycarbonate lens is sheared off the board by a plunger F First level packaging tests Test procedure Reliable joining is an essential prerequisite when bonding optoelectronic components. Various standardized test procedures can be used to verify whether adhesives comply with the relevant requirements. These tests are an important reference for us to optimally advise our customers on their choice of adhesives. Among other things, DELO DUALBOND adhesives achieve very good results in humidity storage, thermal shock and repeated reflow tests, thus ensure longlasting bonding stability....

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Adhesive and Process Solutions for LED Packaging-5

1,000 h LED Bright Test™ DELO DUALBOND OB: Permanently high intensity Standard acrylate: Outgassing leads to fast LED degradation LED Bright Test™ Adhesives close to the light-emitting diodes are exposed to high stressing due to the heat and radiation given off by the LED. Optical stability may be permanently compromised as a result of yellowing or interaction with decomposition products. DELO DUALBOND adhesives are based on special properties to avoid both these risks. Constant transparency at high temperatures with DELO DUALBOND after 168 h Room temperature Light intensity path in LED Bright...

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Adhesive and Process Solutions for LED Packaging-6

Precise, fast and automated application of lenses with UV adhesives 3 Light curing with DELOLUX 80 2 Placement of the lens on the LED module 1 Dispensing of DELO PHOTOBOND Second level packaging Tension-equalizing adhesives DELO PHOTOBOND product features Adhesives used to join lenses, covers, housing and housing components around LED modules are subject to different requirements to first-level packaging. Above all, due to the greater dimensions and different materials used, they need to be proficient in equalizing any tensions that may arise, for instance, due to changes in temperature. As joins...

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Adhesive and Process Solutions for LED Packaging-7

Bonding a flip-chip with anisotropic conductive adhesive for LED packaging Anisotropic conductive adhesives In many LED applications there has been a clear trend towards the use of ever smaller LED chips; edge lengths of less than 200 μm are by no means uncommon. However, conventional contacting via bond wires with pad sizes already of similar dimensions, results in high light yield losses and processing difficulties. In this case, flip-chip LEDs are the technology of the future. With contacts on the substrate side and anisotropic electrically conductive adhesives they can be bonded directly to...

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Adhesive and Process Solutions for LED Packaging-8

DELO Industrial Adhesives Headquarters ► Germany • Windach / Munich . China • Shanghai Japan • Yokohama Malaysia • Kuala Lumpur Singapore South Korea • Seoul Taiwan • Taipei Thailand • Bangkok USA • Sudbury, MA www.DELO-adhesives.com The data and information provided are based on tests performed under laboratory conditions. Reliable information about the behavior of the product under practical conditions and its suitability for a specific purpose cannot be concluded from this. It is the customer's responsibility to test the suitability of a product for the intended purpose by considering all...

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