Measurement of 3D Thermal expansion and Thermal strain of electronic Components. True Full-Field Measurement of Thermal Expansion on Electronic Components 3D Measuring System Q-400 TCT The Digital Image Correlation System Q-400 TCT is designed for complete three dimensional and highly sensitive thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. the thermal stress of components such as printed circuits, BGA, Flip Chips, etc. The measurement is performed non-contact, on the whole measuring area and on nearly any material. The field of view can be adjusted down to square millimetres. The Q-400 TCT system is fully equipped with a heating device, control electronic and an Image Correlation System on an adjustable support. Q-400 TCT has successfully been used in development and testing of complex (anisotropic) materials, components and structures in electronic applications. It is ideal for the experimental verification of analytical and numerical calculations. The 3D information enables fast determination of the thermal expansion coefficient of materials as well of Complete package for thermal investigations Different lenses are available to adjust the field of view. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. The measurement can be done from room temperature up to 300°C and down to minus 40°C.

Due to the 3D information provided by the Image Correlation technique the Q-400 TCT can not only be applied to flat surfaces, but also to curved surfaces, the measurement of warpage is possible. The sensor is driven by a robust electronic control system with the complete software package ISTRA 4D. The temperature is acquired at each measuring step. It offers automatic or manual measurements, and quantitative data analysis of 3D displacement and thermal strain fields. Sub-micrometer accuracy is achieved depending on the geometrical set-up. The measuring sensor is attached to a vertical support and...