Danfoss Bond Buff er P3


Catalog excerpts

Danfoss Bond Buff er P3 - 1

ENGINEERING TOMORROW Danfoss Bond Buffer P3 Features ■ Junction temperature up to 175 deg C ■ P3 IGBT half bridge module 1000A/1700V ■ Sintered semiconductors and copper wires ■ High power cycling capability ■ NTC temperature sensor ■ Ready for ShowerPower® ■ Up to 15 times higher lifetime ■ Increase power output up to 30% ■ Low stray inductance ■ High power density ■ Soft switching diodes ■ Easy paralleling ■ Designed for harsh environments ■ Multiple semiconductor sourcing ■ Industry standard housing ■ Possible to sinter passive components ■ Other topologies, voltage power classes possible Applications (examples) ■ Motor drives ■ Active frontend ■ Solar central inverter ■ Wind turbine ■ UPS ■ Traction

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Danfoss Bond Buff er P3 - 2

ENGINEERING TOMORROW Danfoss Silicon Power Based in Flensburg, Germany, Danfoss Silicon Power is a leading developer of customer specific IGBT and MOSFET modules and power stacks for power intensive applications. Our power modules and power stacks are a preferred choice in demanding automotive and wind power applications and a wide variety of industrial applications. Our 35,000 m2 research, development and production facility is certified according ISO 9001, ISO/TS 16949, ISO 14001, ISO 50001 and OHSAS 18001. This enables us to quickly transfer development projects to high volume production...

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