Base: - Modified epoxy resin, one-part, solvent-free, light activated Curing: - Activation with visible light in the wavelength range of 400 to 550 nm - Cationic mechanism allows curing even in shadow zones with sufficient illumination - Further curing until final strength at room temperature - Heating accelerates, lower temperatures delay reaction Curing parameter: - Depending on thickness and absorption of material involved, thickness of adhesive layer, type of lamp and distance of lamp from adhesive layer Use: - Used for bonding metals, glass, plastics, and other materials as well as for coating, securing or sealing electronic components - Especially for coating boards, sealing relays and switches as well as for bonding stacks of contact Application: Technical data Color - Supplied ready to use and best applied from the original container or with Cyberbond recommended dispensing units - Surfaces to be bonded should be dry, free of dust, grease, and other contaminants > Cured in layer thickness of approx. 0,1 mm Brown Density [g/cm] 1.1 > at room temperature Viscosity [mPas] 1200 > at 23ӰC Brookfield sp/rot 3/10 Final strength [h] 24 > at RT Shear strength > joint part material glass/glass [MPa] 24 > joint part material PC/PC [Mpa] 30 > joint part material PETP/PETP [MPa] 3 > Intensity: 45 - 50mW/cm Illumination time: 60s Curing time: 24h at room temperature Tensile strength [MPa] 14 > DIN 53504 Page 1 of 2 size="-1">

Elongation at tear [%] 3 > DIN 53455 Modulus of elasticity [MPa] 730 > DIN 53457 Shore hardness A 86 > DIN 53505 Shore hardness D 49 > DIN 53505 Water absorption [%] 1.3 > DIN 53495, 24 h at RT Coefficient of elongation [1/K] 100xE > -6 Temperature range for use > Permanent use [C] -30 to +150 > Instant use [аC] +180 Thermal conductivity [W/mK] 0.27 Specific volume 2.4xE > 13 resistance > D [ cm] > VDE 0303, part 3 Surface resistance R > o [ ] 2.6xE > 11 VDE 0303, part 3 Breakdown voltage E > d [kV/mm] 18.1 > VDE 0303, part 2 Dielectric constant > r 5.550 > VDE 0303, part 4 Creep resistance CTI...