Base: - Modified epoxy resin, one-part, solvent-free, light/heat curing Curing: - Activation with visible light in the wavelength range of 400 to 550 nm - In shadow areas product can be cured by heat - Light curing mechanism and heat curing mechanism can be used independently Curing parameter: - Heat-up time of joining parts must be added to curing time - Heat-up time should not exceed 15 min - Depending on thickness and absorption of material involved, thickness of adhesive layer, type of lamp and distance of lamp from adhesive layer - For heat curing in shadow zones preferably a temperature of +130C and a curing time of 3 min can be used - Minimal curing temperature is 120аC with a cure time of 6 min Use: - Used for bonding metals, glass, plastics, and other materials as well as for coating, securing or sealing electronic components - Especially for stress equalizing bondings and sealings, in particular if the bonded part is exposed to high variation in temperature Application: - Supplied ready to use and best applied from the original container or with Cyberbond recommended dispensing units - Surfaces to be bonded should be dry, free of dust, grease, and other contaminants Technical data Color Yellow > Cured in layer thickness of approx. 0,1 mm Density [g/cm] 1.1 > at room temperature Viscosity [mPas] 1600 > at 23ӰC Brookfield sp/rot 3/10 Final strength [h] 24 > at RT Page 1 of 2 size="-1">

joint part material glass/glass [MPa] > joint part material PC/PC [Mpa] > joint part material PMMA/PMMA [MPa] > joint part material glass/Al [MPa] > Intensity: 45 - 50mW/cm Illumination time: 60s Curing time: 24h at room temperature > after delivery in unopened original container at room temperature > NOTE The data contained herein are furnished for information only and are believed to be reliable. Cyberbond L.L.C. cannot assume responsibility for the results obtained by others over whose method Cyberbond L.L.C. does not control. It is the userВs responsibility to determine suitability for the...