PRODUCT DESCRIPTION Cree XLamp XQ-B LEDs revolutionize • Cree’s smallest lighting class lighting-class reliability and a wider spread of light than typical plastic cool white Relative Flux vs. Junction packages. The XQ-B’s innovative wide smooth look in replacement tubes and panel lights while reducing system cost by using fewer LEDs. Relative Spectral Power • 300 mA maximum drive current silicon carbide-based LED chips, XQ-B is optimized to dramatically • Reflow solderable - JEDEC Using Cree’s newest generation of • Wide viewing angle: 140° Reflow Soldering Characteristics.. 6 • Unlimited floor life at lower system cost in non-directional • UL-recognized component Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Product family data sheet

Characteristics Characteristics Thermal resistance, junction to solder point Viewing angle (FWHM) Temperature coefficient of voltage Reverse voltage Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp XQ-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XQ-B Binning and Labeling document. Base Order Codes Minimum Luminous Flux @ 80 mA Calculated...

Relative Spectral Power Relative Spectral Power Distribution Relative Radiant Power (%) Cool White Neutral White Warm White Relative Flux Output vs. Junction Temperature Relative Flux vs. Junction Temperature (IF = 80 mA) 100 Relative Luminous Flux (%) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

Electrical Characteristics (TJ = 25 °C) parallel 300 Relative Intensity vs. Current (Tj = 25°C) parallel Relative Flux vs. Current (TJ = 25 °C) Relative Luminous Flux (%) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

Typical Spatial Radiation Pattern Typical Spatial Distribution Relative Luminous Intensity (%) Thermal Design Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to parallel ambient in order to optimize lamp life and optical characteristics. 350 Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered...

Reflow Soldering Characteristics In testing, Cree has found XLamp XQ-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Tsmax Tsmin Profile Feature Time Lead-Based Solder Lead-Free Solder Preheat: Temperature Min (Tsmin) Preheat: Temperature Max (Tsmax) Average Ramp-Up Rate (Tsmax to Tp) Preheat: Time (tsmin...

Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management...

Mechanical Dimensions NOTICE NOTICE NOTICE CREE CONFIDENTIAL. THIS PLOT INFORMATION CONFIDENTIAL. THIS PLOT AND THE AND THE INFORMATION CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND AINED WITHIN ARE THE PROPRIETARY AND CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION INC. THIS PLOT DENTIAL INFORMATION OF CREE,OF CREE, INC. THIS PLOT CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT OT MAY NOT BE REPRODUCED OR DISCLOSED TO ANY TO ANY BE NOT BE COPIED, REPRODUCED OR DISCLOSED MAY COPIED,COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED...

INFORMATION RY AND C. THIS PLOT ISCLOSED TO ANY RITTEN CONSENT Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm 1.500 +.10 -.00 ±.1 4.0 Cathode Side ANODE SIDE Anode Side (denoted by + and circle) User Feed Direction REFERENCE VENDOR PART NUMBER 021142 Loaded Pockets (2,000 Lamps) Trailer 160 mm (min) of empty pockets sealed with tape (20 pockets min.) THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER...

Packaging The diagrams below show the packaging and labels Cree uses to ship XLamp XQ-B LEDs. XLamp XQ-B LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label with CREE Bin Code Cree Bin & Barcode Label Code, Qty, Lot # Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty, Lot #, PO Code, Qty, Lot# # Packaged Reel Patent Label Label with LabelQty, Customer Order with Cree Order Code, Code, Reel ID, PO # Qty, Reel ID, PO...