PRODUCT FAMILY DATA SHEET Cree® XLamp® XB-H LEDs PRODUCT DESCRIPTION FEATURES TABLE OF CONTENTS lumen output and efficacy in a white Relative Spectral Power than 500 lumens at 1.5 A, 25 °C bins Relative Flux vs. Junction LEDs to significantly increase the • Low thermal resistance: 4 °C/W Relative Chromaticity vs Current LEDs that offers the industry's • Reflow solderable - JEDEC Reflow Soldering Characteristics.. 8 LEDs enable lighting manufacturers any lighting design, create smaller and less expensive systems, and develop new lighting solutions that were previously not possible. Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree, Inc. Cree logo and XLamp® are registered trademarks of Cree, Inc. 4600 Silicon Drive

Characteristics Characteristics Thermal resistance, junction to solder point Viewing angle (FWHM) Temperature coefficient of voltage ESD withstand voltage (HBM per Mil-Std-883D) Reverse voltage Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

Flux Characteristics (TJ = 85 °C) The following table provides several base order codes for XLamp XB-H LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XB Family Binning and Labeling document. Base Order Codes Min. Luminous Flux @ 700 mA Calculated Minimum Luminous Flux (lm)** @ 85 °C Order Code Warm White Neutral White Outdoor White Cool White Cree maintains a tolerance of ±7% on flux and power...

Relative Spectral Power Relative Spectral Power Distribution Relative Radiant Power 60% Cool White Warm White 40% Relative Flux Output vs. Junction Temperature Relative Flux vs. Junction Temperature (IF = 700 mA) Relative Luminous Flux Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

XLamp xB-H leds Electrical Characteristics (Tj = 25ºC) Relative Intensity vs. Current (Tj = 25ºC) Relative Flux vs. Current (TJ = 85 °C) 180% Relative Luminous Flux Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

Delta CCT vs. Current Relative Chromaticity vs Current and Temperature (Warm White*) 0.006 ΔCCx ΔCCy ΔCCx ΔCCy * Warm White XLamp XB-H LEDs have a typical CRI of 80. Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

Typical Spatial Radiation Pattern Typical Spatial Distribution Relative Luminous Intensity Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is Thermal Design crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 1600 Copyright © 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks...

Reflow Soldering Characteristics In testing, Cree has found XLamp XB-H LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP Tsmax Tsmin Profile Feature Lead-Based Solder Lead-Free Solder Preheat: Temperature Min (Tsmin) Preheat: Temperature Max (Tsmax) Average Ramp-Up Rate (Tsmax to Tp) Preheat: Time (tsmin to...

Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management...

6 CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND 4 NOTICE 5 5 CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION MAY NOT BE COPIED, REPRODUCED OR AND TICE CONTAINED WITHIN ARE THE PROPRIETARYDISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT MATION HIS PLOT AND THE INFORMATION CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT OF CREE E THE PROPRIETARY BE INC. MAY NOT AND COPIED, REPRODUCED OR DISCLOSED TO ANY S PLOTOF CREE, INC. THIS PLOT ATION UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT SED...

NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. ADDED CATHODE AND ANODE NOTE CHANGED POCKET DIMS AND TOLERANCES Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. C 1.50 +.10/-.00 CATHODE SIDE ANODE SIDE Cathode Side REFERENCE VENDOR PART NUMBER 020246 Anode Side (denoted by + and circle) UNLESS OTHERWISE SPECIFIED...