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XLamp ML-B

XLamp ML-B
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Product family data sheet Cree XLamp ML-B LEDs Relative Spectral Power lighting-class performance LEDs. The XLamp ML-B expands • ANSI-compatible sub-bins • Maximum drive current: Relative Flux vs. Junction to linear and distributed lighting applications. With XLamp lightingclass reliability, a wide viewing angle, uniform light output, and industry-leading 175 mA • 120° viewing angle, uniform chromaticity profile • Electrically neutral thermal path • UL-recognized component XLamp Cree’s innovation in LEDs for lighting high performance and a smooth look to a wide range of lighting lighting, fluorescent retrofits and retail-display lighting. Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300

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Characteristics Characteristics Thermal resistance, junction to solder point Viewing angle (FWHM) Temperature coefficient of voltage Reverse voltage Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp ML-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp ML-B LED Binning and Labeling document. Base Order Codes Min. Luminous Flux (lm) @ 80 mA...

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Relative Spectral Power Distribution Relative Radiant Power (%) Relative Flux vs. Junction Temperature (IF = 80 mA) 100% Relative Luminous Flux Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

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Relative Flux vs. Current (TJ = 25 °C) Relative Luminous Flux (%) Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

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Typical Spatial Distribution Relative Luminous Intensity (%) Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 200 180 Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc.

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Reflow Soldering Characteristics In testing, Cree has found XLamp ML-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder Preheat: Temperature Min (Tsmin) Preheat: Temperature Max (Tsmax) Average Ramp-Up Rate (Tsmax to Tp) Preheat: Time (tsmin to tsmax) Time...

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Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at...

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Storage Conditions XLamp ML-B LEDs that have been removed from the original MBB packaging but not soldered should be stored in one of the following ways: • Store the parts in a rigid metal container with a tight-fitting lid. Verify that the storage temperature is <30 °C, and place fresh desiccant and an RH indicator in the container to verify that the RH is no greater than 60%. Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater than 60%. For short-term store only: LEDs can be resealed in the original MBB...

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All measurements are ±.13 mm unless otherwise indicated. Bottom View -Cathode Mark -Thermal vias to backside plane Recommended MCPCB Solder Pad Side View Copyright © 2010-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered

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NOTICE EE CONFIDENTIAL. THIS PLOT AND THE INFORMATION NTAINED WITHIN ARE THE PROPRIETARY AND NFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT Y NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY AUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT CREE INC. ADDED CATHODE AND ANODE NOTES Cathode Side Tape and Reel +.3 12.0 All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. .0 All dimensions in mm. Cathode Anode Side Mark (denoted by + and circle) User Feed Direction CATHODE SIDE Trailer 160mm (min) of empty pockets Trailer 160mm with (min) of sealed pockets tape...

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Packaging Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label with CREE Bin Code Cree Bin & Barcode Label Code, Qty, Lot # Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty, Lot #, PO Code, Qty, Lot# # Packaged Reel Patent Label Label with LabelQty, Customer Order with Cree Order Code, Code, Reel ID, PO # Qty, Reel ID, PO # Humidity Indicator Card (inside bag) Label with Cree Bin Code, Qty, Reel ID Boxed Reel Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Patent Label (on...

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