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HPFS® 8655 Fused Silica

HPFS® 8655 Fused Silica

HPFS® 8655 Fused Silica

Product catalog summary
Product Overview: HPFS® 8655 is a high-purity synthetic fused silica glass known for its low water content and exceptional stability under deep ultraviolet (DUV) laser exposure. It is primarily used in microlithography for optical lenses due to its minimized absorption and low polarization birefringence.
Specifications: The product is characterized by its inclusion class and homogeneity. Inclusions with a diameter ≤ 0.10 mm are disregarded. The index homogeneity is measured using an interferometer at 632.8 nm, with a minimum thickness requirement of 20 mm for verification.
Grades and Classes: The product is available in different grades (AA, A, C, F) based on total inclusion cross-section and maximum size. The HPFS® 8655 grade ensures high transmittance with Ti ≥ 99.75%/cm at 193 nm and initial absorption k ≤ 0.0005 ppm/cm at 193 nm.
Mechanical and Thermal Properties: Key properties include an elastic modulus of 73 GPa, shear modulus of 31 GPa, and a density of 2.2 g/cm³. The material exhibits a Knoop hardness of 489 kg/mm² and a thermal conductivity of 1.38 W/(m K).
Optical Properties: The refractive index and dispersion are described using the Sellmeier equation, with constants provided for various wavelengths. The material has a stress coefficient of 35.0 nm/cm MPa and meets ISO 10110-4 Class 5 for striae.
Contact Information: Corning provides sales offices across North America, Europe, Asia, and Australia for customer support and product inquiries. Additional information can be accessed through their website or by contacting [email protected].
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Catalog excerpts

HPFS® 8655 Fused Silica-1

HPFS® 8655 Fused Silica Optical Materials Product Information Specialty Materials Division

 Open the catalog to page 1
HPFS® 8655 Fused Silica-2

HPFS® 8655 Fused Silica Mechanical and Thermal Properties HPFS® 8655 fused silica is an extremely pure synthetic glass with very low water content which leads to an exceptionally stable and predictable dynamic behavior under deep ultraviolet (DUV) laser exposures. It is a compaction only material, showing no expansion, with a much greater resistance versus the well-known standard compaction curve resulting in the lowest possible induced wave front distortion. Unless otherwise stated, all values @ 25 °C Elastic (Young’s) Modulus 73 GPa Shear Modulus 31 GPa Modulus of Rupture, abraded 52.4 MPa...

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HPFS® 8655 Fused Silica-3

Refractive Index and Dispersion Conditions: 22 ˚C, 760 mm Hg, N2 Wavelength [Vacuum] λ [nm] Thermal Coefficient2 ∆n/∆T [ppm/K] Sellmeier Dispersion Equation Constants1, 20 ˚C Sellmeier Dispersion Equation Constants1, 22 ˚C Sellmeier Dispersion Equation Constants1, 25 ˚C ∆n/∆T Dispersion Equation Constants2, 20-25 ˚C 1.980644E-04 Other Optical Properties Stress Coefficient ≤ 1 nm/cm, lower specifications available *1 Sellmeier Equation: n2-1 = A1 λ2/( λ2 - B1) + A2 λ2/( λ2 – B2) + A3 λ2/( λ2 – B3) + A4 λ2/( λ2 – B4) with λ in μm *2 ∆n/∆T Equation: ∆n/∆T [ppm/K] = D0 + D1λ2 + D2λ-2 + D3λ-4 + D4λ-6...

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HPFS® 8655 Fused Silica-4

Worldwide Accessibility We are here to help you specify the best product for your application. For further information, please contact: North America Sales Office Corning Incorporated Semiconductor Optics Business 334 County Route 16 Canton, NY 13617 t: 315.379.3364 f: 315.379.3344 Asia Sales Offices Corning International K.K. Japan Akasaka Intercity, 7th Floor 1-11-44, Akasaka, Minato-ku, Tokyo 107-0052 Japan t: 81.3.3586.1052 f: 81.3.3587.0906 Corning Korea Company Ltd. 6th Floor, Gangnam Finance Center 737 Yeoksam-Dong Gangnam-Gu Seoul, Korea 135-984 t: 82.2.796.7500 f: 82.2.796.7300 China...

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