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CoorsTek Amazing Solutions” Aluminum Nitride Substrates AlN-170
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Material Property Test Methods Thermal Conductivity 25° C W/(m K) ASTM E1461 s 170 Nominal Density Surface Finish As-fired (Ra) Lapped Polished Flexural Strength pinch (micron) 5.08 pm Radius Stylus; 2,540 s 25 (s 0.6) pm Cutoff ANSI/ ASME B46.1 s 2 (s 0.05) Dielectric Strength (60 cycles Kv/mm AC avg. RMS), 0.635mm thick (room temp) Dielectric Constant (Relative Permittivity), 1 MHz Dissipation Factor (Loss Tangent) 1MHz • Polishing • Laser etching Aluminum Nitride Advantages • High heat dissipation with thermal conductivity of 170 W/m K • Non-toxic alternative to BeO •...
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