High Performance COM Express® Formfactor Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout Highest Performance COM Express Type 2 3rd Generation Intel® Core™ processor-based platform Better transcode HD-HD, HD Video Conferencing Improved Graphics Performance, DirectX®11 Integrated dual channel memory controller, up to 25,6 GByte/sec. memory bandwidth, Integrated Intel® HD Graphics with dynamic frequency up to 1100 MHz, Intel® Clear Video HD Technology 2 Sockets, SO-DIMM DDR3 1600 MHz, up to 16 GByte Mobile Intel® 7 Series Chipset: Intel® QM77/ HM76 Intel® 82579 GbE LAN Controller with AMT 8.0 support (optional) 6x PCI Express™ GEN 2.0 lanes, 4x Serial ATA® (AHCI) with RAID support, 1x EIDE (UDMA-66/100) optional, 8x USB 2.0 (EHCI), PCI Bus 33 MHz Rev. 2.3, LPC bus, I²C bus (fast mode, 400 kHz, multi-master) Digital High Definition Audio Interface with support for multiple audio codecs Intel® Flexible Display Interface (FDI), OpenGL 3.1 and DirectX11 support, Three simultaneous independet displays. High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s, hardware motion compensation Dual channel LVDS transmitter, supports flat panels 2x24 Bit interface, VESA mappings, resolutions up to 1920x1200, Automatic Panel, Detection via EDID/EPI 3x ports shared with Display Port 340.4 MHz RAMDAC, resolutions up to QXGA (2048x1536) 1 x Intel compliant SDVO ports with 200MPixel/sec. Supports external DVI congatec Board Controller Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control Embedded BIOS Features AMI Aptio® UEFI 2.x firmware, 8 MByte serial SPI firmware flash The conga-BS77 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels. Power Management ACPI 3.0 with battery support Operating Systems Microsoft® Windows 8, Microsoft® Windows 7, Microsoft® Windows® embedded Standard, Microsoft® Windows XP, Linux Power Consumption Typ. application: Processor TDP: 17 .. 25 W, see manual for full details Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. congatec AG, Auwiesenstraße 5, 94469 Deggendorf, Germany Phone +49 (991) 2700-0, Fax +49 (991) 2700-111, [email protected]

Block Diagram Order Information Article Intel® FDI (Flexible Display Interface) Digital Display Interface COM Express Type 2 Basic modul with Intel® Core™ i7-3555LE dual core processor with 2.5GHz, 4MB L2 cache and 1600MT/s dual channel DDR3 memory interface. Processor TDP 25W. COM Express Type 2 Basic modul with Intel® Core™ i7-3517UE dual core processor with 2.3GHz, 4MB L2 cache and 1600MT/s dual channel DDR3 memory interface. Processor TDP 17W. COM Express Type 2 Basic modul with Intel® Core™ i5-3610ME dual core processor with 2.7GHz, 3MB L2 cache and 1600MT/s dual channel DDR3 memory interface....