High Performance COM Express® Formfactor Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout Intel® Core™ i7-2655LE, 2.20 GHz, (32 nm process, 4MB cache, 1333 MHz, TDP 25 W) Intel® Core™ i7-2610UE, 1.50 GHz, (32 nm process, 4MB cache, TDP 17 W) Intel® Core™ i3-2340UE, 1.30 GHz (32nm process, 3MB cache, TDP 17W) Intel® Celeron® Processor 847E, 1.1GHz (32nm process, 2 MB cache, TDP 17W) Intel® Celeron® Processor 827E, 1.4 GHz (32nm process, 1.5 MB cache, TDP 17W) Intel® Core™ 2nd Generation CPUs Extreme graphics performance COM Express™ Type 2 module featuring DisplayPort and HDMI Integrated dual channel memory controller, up to 25,6 GByte/sec. memory bandwidth Integrated Intel® HD Graphics with dynamic frequency up to 1100 MHz, Intel® Clear Video HD Technology 2 Sockets, SO-DIMM DDR3 1333 MHz, up to 16 GByte Mobile Intel® 6 Series Chipset, Intel® QM67/HM65 Platform Controller Hub Gigabit Ethernet, Intel® Ethernet PHY optional 6x PCI Express™ lanes, 4x Serial ATA® (AHCI) with RAID support, 1x EIDE (UDMA-66/100) optional, 8x USB 2.0 (EHCI), PCI Bus 33 MHz Rev. 2.3, LPC bus, I²C bus (fast mode, 400 kHz, multi-master) Digital High Definition Audio Interface with support for multiple audio codecs Processor integrated Mobile Intel® 6 Series HD graphics, OpenGL 3.0 and DirectX 10.1 support, two independent pipelines for full dual view support, High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 Mbit/s, hardware motion compensation (using HDMI 1.4 with 3D), no PEG support Dual channel LVDS transmitter, supports flat panels 2x24 Bit interface, VESA mappings, resolutions up to 1920x1200, Automatic Panel, Detection via EDID/EPI 3x ports shared with Display Port 350 MHz RAMDAC, resolutions up to QXGA (2048x1536) 1 x Intel compliant SDVO ports with 200MPixel/sec. Supports external DVI, TV and LVDS transmitter congatec Board Controller Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control Embedded BIOS Features AMI Aptio® UEFI 2.x firmware, 8 MByte serial SPI firmware flash The conga-BM67 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels. Power Management ACPI 3.0 with battery support Operating Systems Microsoft® Windows 8, Microsoft® Windows 7, Microsoft® Windows® embedded Standard, Microsoft® Windows XP, Linux Power Consumption Typ. application: Processor TDP: 17 .. 25 W, see manual for full details Humidity Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. congatec AG, Auwiesenstraße 5, 94469 Deggendorf, Germany Phone +49 (991) 2700-0, Fax +49 (991) 2700-111, [email protected]

Order Information conga-BS67 Article High Definition Audio (HDA) I/F Digital Display Interface Intel® BD82QM67 PCH (Intel® BD82HM65 for Celeron™ equipped modules) PCIe to PCI Bridge Intel® certified Pericom Intel® Core™ i3-2340UE dual core processor with 1.3GHz, 3MB L2 cache and 1333MT/s dual channel DDR3 memory interface. Intel® Celeron® 847E dual core processor with 1.1GHz, 2MB L2 cache and 1066MT/s dual channel DDR3 memory interface for up to 4GB. Intel® Celeron® 827E single core processor with 1.4GHz, 1.5MB L3 cache and 1066MT/s dual channel DDR3 memory interface for up to 4GB. Standard heatspreader...