Catalog excerpts
COM Express® Basic Module c.co Maximum Computing Performance Formfactor COM Express™ Basic, (95 x 125 mm), Type II Connector Layout Intel® Core™ i7-620M, 2.66 GHz (32 nm process, 4MB cache, 1066 MHz, TDP 35 W, PGA package) Intel® Core™ i5-520M, 2.4 GHz (32 nm process, 3MB cache, 1066 MHz, TDP 35 W, PGA package) Intel® Celeron™ P4500, 1.86 GHz (32nm process, 2MB cache, TDP35 W, PGA package) up to Intel® Core™ i7 Processors 2.66 GHz Integrated dual channel memory controller, up to 17.1 GByte/sec. memory bandwidth Integrated Intel® HD Graphics with dynamic frequency up to 667 MHz Intel® Clear Video HD Technology Highest end graphics performance 2 Sockets, SO-DIMM DDR3 1333 MHz, up to 8 GByte Intel® 5 Series Chipset: Intel® HM55 Intel® 82577LM Ethernet PHY 5x PCI Express™ lanes, 3x Serial ATA® (AHCI) no RAID support, 1x EIDE (UDMA-66/100) optional, 2x ExpressCard®, 8x USB 2.0 (EHCI), PCI bus 33 MHz Rev. 2.3, LPC bus, I²C bus (fast mode, 400 kHz, multi-master) Digital High Definition Audio Interface with support for multiple audio codecs Processor integrated Mobile Intel® 5 Series HD graphics OpenGL 2.1 and DirectX10 support, Two independent pipelines for full dual view support High performance hardware MPEG-2 decoding, WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s, hardware motion compensation, no PEG support Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface, VESA mappings, resolutions up to 1920x1200, Automatic Panel Detection via EDID/EPI 3x DisplayPorts 1.1 shared with HDMI 3x ports shared with DisplayPorts 350 MHz RAMDAC, resolutions up to QXGA (2048x1536) Supports one SDVO port shared with HDMI and DisplayPort capable of driving a 200MP pixel rate congatec Board Controller Multi Stage Watchdog, non-volatile User Data Storage, Manufacturing and Board Information, Board Statistics, BIOS Setup Data Backup, I²C bus (fast mode, 400 kHz, multi-master), Power Loss Control Embedded BIOS Features AMI Aptio® UEFI 2.x firmware, 4 MByte serial SPI firmware flash The conga-BM57 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels. Power Management ACPI 3.0 with battery support Operating Systems Microsoft® Windows 8, Microsoft® Windows 7, Microsoft® Windows XP, Microsoft® Windows® embedded Standard, Linux Power Consumption Typ. application: tbd., see manual for full details, CMOS Battery Backup Operating: 10 - 90% r. H. non cond. Storage: 5 - 95% r. H. non cond. congatec AG, Auwiesenstraße 5, 94469 Deggendorf, Germany Phone +49 (991) 2700-0, Fax +49 (991) 2700-111, info@congatec.com Intel® Turbo Boost Technology up to 3.33 GHz © 2013 congatec AG. All rights reserved. All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee of correctness is implied or expressed. The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner‘s license agreements, which are avaialable at www.congatec.com and/or upon request. Product names, logos, brands, and other trademarks featured or referred to within this datasheet, or the congatec website, are the property of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website. Rev. September 24, 2013 MD
Open the catalog to page 1Order Information conga-BM57 Article Intel® Celeron® P4500 processor with 1.86 GHz, 2MB L2 cache and 800MT/s dual channel DDR3 SODIMM memory interface for up to 8GB. Intel® Core™ i5-520M processor with 2.4GHz, 3MB L2 cache and 1066MT/s dual channel DDR3 memory interface. High Definition Audio (HDA) I/F Standard passive cooling solution for high performance COM Express module conga-BM57 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. Standard passive cooling solution for high performance COM Express module conga-BM57...
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