Press contact: CONEC Elektronische Bauelemente GmbH Katja Schade Ostenfeldmark 16 Title: CONEC M8x1 Insulation body/Sockets SMT/THR * only available as 3and 4-pos. version Constant miniaturising of electronic component groups results in more and more compact circuit boards with surface-mounted components. This is the reason why CONEC has designed and produced a compact M8x1 connector series for SMT surface mounting. In addition to the SMT series, a THR type was developed which is also appropriate for surface mounting and reflow processes. This soldered solution offers the renowned stability of wave soldering. Thus, the user can mount the socket housing either to the front or to the back of his device. Subsequently, the board equipped with the insulation body can be mounted from the inside (combined mounting). In addition, the connectors are ideal for integrated designs where the M8 thread is moulded to the housing of the customer, providing maximum design flexibility. By default, the degree of protection in mounted condition to housing is IP67, on the connector face in unscrewed condition IP20. Fields of application: • Drive technology • Housing and device connection • Encoder manufacturers • Sensor technology Benefits: • Flexibility in device connection • Maximum design flexibility • Consisting of two parts (Insulation body and socket housing) • Modular structure • Available in SMT and THR technology • Suitable for front and back panel mounting • Available for various installation heights • Automated mounting possible

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