Moulding

Moulding

Moulding

Product catalog summary
Overview: Comline Elektronik Elektrotechnik GmbH offers comprehensive services in the design and manufacturing of injection moulds, from prototypes to high-volume series, with a focus on customer-specific requirements and competitive pricing. The company emphasizes quick reaction and delivery times, facilitated by complete in-house production.
Key Services:
  • Realization of customer requirements and individual designs.
  • Design and construction of moulds.
  • Production capabilities ranging from prototypes to series production.
  • Short reaction and delivery times.
  • Complete in-house manufacturing.
  • Competitive pricing.
Applications:
  • Overmoulding of connectors, cables, mechanical components, housings, electronic components, and circuit boards.
  • Protection of electronic components from environmental influences such as moisture, dust, and vibrations.
Technologies:
  • Low Pressure Moulding: An innovative process offering a fast and cost-effective alternative to conventional encapsulation or potting, suitable for high-volume production with moderate temperature levels.
  • Injection Moulding: A forming process for various types of plastics, allowing for single or multi-cavity moulds.
Benefits:
  • Cost-effective prototypes and efficient production for small and medium-sized batches.
  • High filling volumes at moderate temperatures, compatible with electronics.
  • Capability to handle small filling volumes with hard materials at high pressures and temperatures.
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Catalog excerpts

Moulding-1

Advanced ft Wiring SystemS und Spritzguss Low Pressure Moulding: Ein innovatives Niederdruck-Spritzgussverfahren, welches eine schnelle und kosten-gunstige Alternative zur her-kommlichen Verkapselung oder zum Vergiefien bietet. Ein Urform-Verfahren fur verschiedenste Arten von Kunststoffen. Kundenspezifisch umspritzte Kabelkonfektionen Durch das Umspritzen von elektronischen Komponenten werden diese vor Umwelt-einflussen wie Feuchtigkeit, Staub und Vibrationen geschutzt. Gleichzeitig entsteht eine sichere Verbindung zwischen elektronischer Komponente und Leitung. Die Bauteile werden bei diesem Vorgang nicht beschadigt; die Kunststoffummantelung ist vergleichbar mit einer schutzenden Hulle. Dieses Verfahren eroffnet eine Vielzahl von Anwendungsmoglichkeiten, wobei die Materialeigenschaften der verwendeten Kunststoffe schier grenzenlos sind. Umspritzung etwa von... • Steckverbindern und Leitungen • Mechanischen Komponenten und Gehausen Elektronischen Bauteilen Unser Angebot • Realisierung von Kundenwunschen und individuellen Formen • Herstellung von Prototypen bis hin zur Serie • Sehr kurze Reaktions- und Lieferzeiten • Alles aus kompletter In-House-Fertigung • Wirtschaftliche Preise Comline Elektronik Elektrotechnik GmbH Karl-Rapp-Strafie 1 • 92442 Wackersdorf • Germany Fon +49 9431 / 7565-0 • Fax 7565-25 [email protected] • www.comline-elektronik.de

 Open the catalog to page 1
Moulding-2

Advanced ft Wiring SystemS and Injection Moulding Low Pressure Moulding: An innovative low pressure injection moulding process that provides a fast and cost effective alternative to conventional encapsulation or potting. A forming process for various types of plastics Customer-specific overmoulded wiring systems The encapsulation of electronic components protects them from environmental influences against moisture, dust dirt and vibration. At the same time, the encapsulation serves as a connection between the electronic component and the cable. The components are not damaged during this process;...

 Open the catalog to page 2

All Comline Elektronik Elektrotechnik GmbH catalogs and technical brochures

  1. sFTIR

    1  Page

  2. Development

    2  Pages

  3. IRSphinx ATR

    1  Page

  4. Cable-Systems

    2  Pages

  5. Processing

    2  Pages

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.