• 850 nm multimode emission with low spectral width and low threshold/operation current.
• High reliability and humidity robustness compliant with GR468.
• Low electrical parasitics and data rates from DC to 10 Gb/s.
• Dual top contact configuration with common cathode electrodes.
• Available as single chip, 4 and 12 channel array, RoHS compliant.
• Applications include single channel and parallel fiber optical communication links at 10 Gb/s up to 300 m, smart cables, and HDMI.

• Diced wafer on UV tape on metal lead frame.
• Grip ring and Gel-Pak options available.

• Threshold current: 0.8 - 1.1 mA.
• Slope efficiency: 0.34 - 0.52 mW/mA.
• Optical output power: 1.4 - 2.2 mW.
• Operating voltage: 1.9 - 2.1 V.
• Emission wavelength: 840 - 860 nm.
• Modulation bandwidth: 9 GHz.
• Rise and fall times: 30 - 45 ps.
• Capacitance: 0.2 - 0.3 pF.
• Beam divergence: 24 - 30°.
• Relative Intensity Noise: -128 dB/Hz.

• Wavelength tuning coefficient: 0.06 nm/K.
• Slope efficiency variation: -0.5 to -0.1 %/K.
• Thermal impedance: 3.0 K/mW.

• Optical output power: 8 mW.
• Peak forward current: 12 mA.
• VCSEL reverse voltage: 5 V.
• Operating temperature: -10 to +85 °C.
• Storage temperature: -40 to +100 °C.
• Mounting temperature: 260 °C.

• Die length varies by product code, ranging from 210 to 3000 µm.
• Die width: 260 - 300 µm.
• Die height: 135 - 165 µm.

Performance figures and data are typical and must be confirmed in writing by Coherent before application. Specifications may change without notice.

Coherent is committed to environmental protection and sustainable development, ensuring all products are RoHS compliant.

• Product codes and descriptions are provided for various packaging options, including diced wafer on metal lead frame, grip ring, and Gel-Pak.