Unpatterned Wafer 3D Inspection System WD4000 Series Unpatterned Wafer 3D Inspection System Professional Inspection Equipment Application Thickness and warpage measurement for unpatterned wafer Description Unpatterned Wafer 3D Inspection System WD4000 series can automatically measure wafer thickness, surface roughness, and micro-nano 3D microtopography at a time. Use white light confocal probes to measure wafer thickness, TTV, LTV, BOW, WARP, line roughness; use white light interferometry probe to scan the Wafer surface to create a 3D profile image of the surface , then analyze the roughness and relevant 2D and 3D parameters according to ISO/ASME/EUR/GBT Measurement results of wafer thickness and warpage The 3D shape based on the upper and lower surfaces of the wafer is reconstructed by non-contact measurement. The powerful measurement and analysis software ensures the stable calculation for the thickness, roughness, total thickness variation(TTV) of the wafer.

Unpatterned Wafer 3D Inspection System WD4000 Series Unpatterned Wafer 3D Inspection System Professional Inspection Equipment Application Thickness and warpage measurement for unpatterned wafer Description Unpatterned Wafer 3D Inspection System WD4000 series can automatically measure wafer thickness, surface roughness, and micro-nano 3D microtopography at a time. Use white light confocal probes to measure wafer thickness, TTV, LTV, BOW, WARP, line roughness; use white light interferometry probe to scan the Wafer surface to create a 3D profile image of the surface , then analyze the roughness and...

Unpatterned Wafer 3D Inspection SystemI ApplicationRoughness measurement for unpatterned wafer Thinned silicon wafer rough grinding silicon wafer fine grinding silicon wafer Multi-file analysis of 25 times measurement data for fine grinding wafer During rough grinding and fine grinding process for the Wafer thinning, the surface roughness Sa values and their stability are used to evaluate the processing quality. When the thinned silicon wafer is measured in the strong noise environment of the production workshop, the roughness Sa values of the fine grinding silicon wafers are ranging around 5nm,...

Unpatterned Wafer 3D Inspection System| Parameters Model No. Thickness Measurement System Arsenide, nitride, phosphorus, germanium, phosphorurate, lithium crickets, sapphire, si [icon, silicon carbide, glass, etc. High-precision white light confocal sensors Measuring Range Scanning Path Measurement Parameters Full map area scanning, Union Jack path, free multi-point Thickness, TTV (Total thickness variation), LTV, BOW, warp, flatness, line roughness 3D microtopography Measurement System *1 Roughness performance is obtained by measuring SQ parameters for a 0.2nm SA silicon wafer in the laboratory...