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3D Optical Surface Profilometer SuperView W3

3D Optical Surface Profilometer SuperView W3

3D Optical Surface Profilometer SuperView W3

Product catalog summary
Overview: The document describes the SuperView W3, a 3D optical surface profiler designed for large-scale microscopic form and roughness measurement, particularly in the semiconductor field. It supports automatic measurement for 12" wafers and can measure film step-height ranging from 1nm to 1mm.
Key Features:
  • One-key automatic measurement for ease of use.
  • Capability to measure roughness of silicon cut sheets post-grinding and obtain average values from multiple small areas with a single click.
  • Supports 6", 8", and 12" wafer measurements with easy switching between vacuum chuck sizes.
Technical Specifications:
  • Model: SuperView W3
  • Size: 1000x800x1550 mm
  • Weight: 500 kg
  • Light Source: White LED
  • Video System: 1024x1024 resolution
  • Objective Lens: 10x with options for 2.5x, 5x, 20x, 50x, 100x
  • Optical Zoom: 0.5x with options for 0.75x, 1x, 0.375x
  • Standard Field of View: 0.98x0.98 mm
  • Motorized 5-hole turret
  • XY Object Table Size: 450x450 mm
  • Travel Range: 300x300 mm
  • Load Capacity: 10 kg
  • Z Axis Travel Range: 100 mm
  • Z Resolution: 0.1 nm
  • Roughness RMS Repeatability: 0.005 m
  • Step Height Measurement Accuracy: 0.3%
  • Repeatability: 0.08% 1σ
Environmental Requirements:
  • No strong magnetic fields or corrosive gases.
  • Operating temperature: 0°C to 30°C with fluctuations less than 2°C/60min.
  • Relative humidity: 5% to 95% RH, no condensation.
  • Power: 300W
  • Environmental vibration: VC-C or better.
  • Compressed air: 0.6Mpa, oil-free, water-free.
Notes:
  • Roughness measurement is based on Sa 0.2nm silicon wafer in a lab environment according to ISO 25178.
  • Step height measurement follows ISO 10610-1:2009 standards.
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Catalog excerpts

3D Optical Surface Profilometer SuperView W3-1

3D Optical Surface Profilometer SuperView W3 3D Optical Surface Profilometer Large-scale microscopic 3D form and roughness Light Source Video System Objective Lens Optical Zoom Lens Turret Motorized 5 holes turret Large table Applicable for 12" wafer One-key automatic measurement Travel Range Load Capacity Control Method Travel Range Control Method Z- Stroke Scanning Range Z Resolution Roughness RMS Repeatability *1 Accuracy *2 Step Height Measurement Repeatability *2 Operating environment: No strong magnetic field, no corrosive gas Environmental vibration: VC-C or better Working temperature: 0°C~30°C fluctuation <2°C/60min Compressed air: 0.6Mpa oil-free, water-free Relative humidity: 5%~95% RH, no condensation Note: *1 Measure Sa 0.2nm silicon wafer in a laboratory environment according to the ISO 25178 *2 Measure standard 5μm steps height block in a laboratory environment according to the ISO 10610-1:2009 Dedicated Functions for Semiconductor Field Measure profile trenches after laser grooving in the dicing process. Measure film step-height of wafer ranging from 1nm~1mm. Measure roughness of silicon cut sheet after grinding process, and can measure dozens of small areas to obtain the average value by one click. Support 6", 8" and 12" wafer measurement, and easy switch between 3 sizes of vacuum chucks by one click automaticall

 Open the catalog to page 1
3D Optical Surface Profilometer SuperView W3-2

3D Optical Surface Profilometer SuperView W3 3D Optical Surface Profilometer Large-scale microscopic 3D form and roughness Light Source Video System Objective Lens Optical Zoom Lens Turret Motorized 5 holes turret Large table Applicable for 12" wafer One-key automatic measurement Travel Range Load Capacity Control Method Travel Range Control Method Z- Stroke Scanning Range Z Resolution Roughness RMS Repeatability *1 Accuracy *2 Step Height Measurement Repeatability *2 Operating environment: No strong magnetic field, no corrosive gas Environmental vibration: VC-C or better Working temperature:...

 Open the catalog to page 2

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