SS��� Wafer-Level Dispensing Operation Flow Handling wafer to Aligner by Robot FOUP loading Lowering disc by ejector pin to adsorb wafer For Wafer Form Underfill GS600SW GS���SW is a high-stability and high-precision wafer dispensing machine which is developed based on Underfill process requirements of RDL First WLP. The equipment meets the needs of the semiconductor industry, can be provided with an automatic wafer loading & unloading system, and can automatically realize functions such as wafer handling, alignment, preheating, operation heating and heat dissipation. It is compatible with international semiconductor communication protocols, and is provided with an AMHS automatic loading & unloading robot interface to match the information management requirements and unmanned management trends. Wafer double preheating Handling wafer to heat dissipation station by Robot Wafer-Level Dispensing Machine RHandling wafer to preheating station by Robot Wafer alignment + code scanning Handling wafer to GS���SW dispensing machine by Robot PC101 Heat dissipation of wafer Wafer preheating Handling wafer back to FOUP original position by Robot Features and Advantages Supporting �/��-inch wafer dispensing. Application Fields RDL First WLP Dustproof level ��, meeting the environmental requirements of wafer level packaging. ESD protection meeting international IEC and ANSI standards. Wafer-Level Dispensing System GS���SW wafer-level dispensing machine × � PC��� wafer loading & unloading machine × � SS��� Wafer Level Dispensing System In the whole process of wafer turnover and operation, the temperature is finely controlled and automatically corrected to meet the CUF process requirements while ensuring the product safety. The whole-process video monitoring facilitates product turnover, operation process observation, and problem tracing and analysis. Lifting up of wafer insulation cover for