MINGSEAL TECHNOLOGY Features and Advantages On-Line Mode Yield Improvement Meeting Information Management Requirements Work positions are inspected before and after operation, and the final station is professionally inspected to achieve multiple fool proof. Real-time MES system docking, production status information uploading, and system abnormal status alarm. The on-line mode is used to minimize manual Meeting Stringent Engineering Requirements Full Automation Prevention of Whole Line Downtime Application Fields MEMS Microphone GS600M GS���M is a fully-automatic online dispensing platform developed based on the needs of the MEMS industry. It can provide one-stop solutions for on-line ASIC chip encapsulation, precision solder paste dispensing and multiple foolproof detection, etc. in the MEMS process. High-quality control of the entire production process is realized. The on-line workstation operation can also be selected. ASIC chip encapsulation process Precision solder paste dispensing process Professional Inspection Module Semi-finished product inspection before lid attachment Class-��� dustproof design. ESD protection meeting international IEC and ANSI standards. Good shock absorption with mineral frame structure to effectively reduce the impact caused by high-speed movement. Optional Configurations MEMS Barometer Automatic Loading & Unloading System Weighing Module MEMS Barometer Online Visual Dispensing Machine Ultra-Precision Dispensing Controlle Piezoelectric Jetting Valve Auxiliary Module for Dispensing Process ASIC Chip Encapsulation Potential Problems Too thick glue coverage interferes with packaging. Scattered points splash onto the diaphragm or other components, affecting the product performance. Targeted Solutions By optimized control capability of the equipment and specially designed jetting valve, the glue coverage thickness can be as low as �.��mm and the scattered point problem is solved. Precision Solder Paste Dispensing Potential Problems The glue width of the solder wire exceeds the limit, so that the solder paste overflows inside after packaging. Inconsistent solder wire affects the welding effect. Targeted Solutions The high-precision controller can realize �.��mm glue-line dispensing. Automatic compensation reduces the influence of solder paste level difference and improves the stability. Precision Solder Paste Coating, ASIC Chip Encapsulation and MEMS Chip Operation tracks / conveyor tracks are separated, so that shutdown of a single machine does not affect the operation of the whole line.