INDUSTRY APPLICATION Recommended Products Lid Attach Applied to Underfill process of ��-inch (�-inch compatible) fan-out WLP chips Applied to Lid Attach process for FCBGA and FCCSP, including functions such as AD glue and Tim glue coating, lid attachment and hot pressing Integrated Circuits INDUSTRY APPLICATION Flux Spray Mainly used in the field of integrated circuit packaging, including wafer level package (WLP), flip-chip ball grid array (FCBGA), flip-chip chip scale package (FCCSP) and system-in-package (SiP), etc. Including processes such as Underfill, Dam & Fill, Flux Spray, Solder Paste Painting and Lid Attach. Wafer Dispensing Machine Applied to Dam & Fill process for packaging such as FCBGA Solder Paste Painting Underfill Applied to Flux Spray before flip chip mounting Applied to Solder Paste Painting of SMD pads with special-shaped packaging, and Solder Paste Painting of shield covers, etc. Applied to Underfill process of flip chips with FCBGA and FCCSP, etc., in the form of substrates Fully-Automatic Dispensing Machine