MINGSEAL TECHNOLOGY MINGSEAL TECHNOLOGY Wafer Level Package Features and Advantages Damage-free automatic handling of wafers in magazines and between magazines. Optional Bernoulli fingers for thinning wafers. Customized production to meet customer needs. Meeting customers’ needs for multiple/different types of mag azines and transfer of wafers with different sizes. Provided with automatic opening mechanism for magazines. Provided with efficient filtering device (HEPA specification). ESD protection meeting international IEC and ANSI standards. Supporting semiconductor-related automation protocols. Optional OCR module for Wafer ID, which can deal with barcodes, QR codes, numbers and letters. Application Cases Fully-Automatic Wafer Dispensing System Main System Composition ❶ Loadport & Foup ❺ Heat dissipation station ❸ Code scanning station ❽ Manipulator handling module ❹ Preheating station Case Description: Equipment Front End Module System Equipment Front End Module (EFEM) System The equipment meets the needs of the semiconductor industry, is compatible with international semiconductor communication protocols, supports SECS/GEM communication modules, and matches the information management requirements and unmanned management trends. Wafer Loading System (Loadport) Wafer Transfer Robot (Robot) Wafer Aligner (Aligner) Reading Module (OCR) Wafer Preheating Dispensing machine Dispensing machine The EFEM mainly performs wafer pre-processing and transfer for wafer-level dispensing machines, and is compatible with �-inch/��-inch products and mainstream dispensing equipment in the market. It can realize functions such as automatic wafer handling, alignment, preheating, operation heating and heat dissipation. It is compatible with international semiconductor communication protocols, and is provided with an AMHS automatic loading & unloading robot interface to match the information management requirements and unmanned management trends. Serial Flip-Chip Reflow Operation Main System Composition ❶ Loadport & Foup ❸Manipulator handling module ❹ Conveyor track Case Description: The system is suitable for serial operation of flip-chip reflow equipment, and integrates automatic wafer loading & unloading and flip-chip reflow operations. It can realize functions such as automatic wafer handling, alignment, wafer ID reading, and product transfer between different devices. It is compatible with international semiconductor communication protocols, and is provided with an AMHS automatic loading & unloading robot interface to match the information management requirements and unmanned management trends. The equipment front end module is mainly used to realize automatic supply and unloading of wafers for semiconductor equipment, reduce production costs, improve production efficiency, while ensuring process accuracy and purification requirements. The system has automatic wafer scanning, automatic transfer and automatic calibration functions, can be provided with ID Reader (front and back) according to customer needs, and can be customized based on wafer size, magazine quantity and aligner type, etc. With independent integration, the Company is committed to providing various wafer handling automation system solutions for customers in the semiconductor industry. System Composition