Catalog excerpts
INDUSTRY APPLICATION INDUSTRY APPLICATION Discrete Devices Mainly used in the field of discrete device packaging, including Leadframe Package, Substrate Package and Shell & Case Package, etc. Including processes such as Chip Coating, Solder Paste Painting, Potting, Component Reinforced-Gluing and Underfill. Recommended Products Chip Coating Solder Paste Painting Applied to encapsulation glue jetting process of ASIC chips, etc. Applied to Solder Paste Painting of SMD pads with special-shaped packaging, and Solder Paste Painting of sensor metal shells, etc. Component Reinforced-gluing Applied to Potting process of sensor cavities, etc. Applied to Reinforced-Gluing process of SMDs and Chips, etc. GS600M Fully-Automatic Dispensing Machine Underfill Applied to Underfill process of flip chips
Open the catalog to page 1All Changzhou Mingseal Robot Technology Co. catalogs and technical brochures
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WHOLE-SET EQUIPMENT1 Pages
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Lid Attachment System SS2001 Pages
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Eccentric Screw Valve1 Pages
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CORE COMPONENTS1 Pages
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Buying Guide1 Pages
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AUTOMATION LINE1 Pages
