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Discrete Device Industry Application

Discrete Device Industry Application
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Discrete Device Industry Application

Product catalog summary
Industry Application: The document focuses on the application of MINGSEAL Technology in the discrete device packaging industry. This includes various packaging types such as Leadframe, Substrate, and Shell & Case Packages. Key processes involved are Chip Coating, Solder Paste Painting, Potting, Component Reinforced-Gluing, and Underfill.
Recommended Products:
  • Underfill: GS600SU/GS600SUA Underfill Dispensing Machine is recommended for underfill processes, particularly for flip chips.
  • Chip Coating: This is applied to the encapsulation glue jetting process of ASIC chips.
  • Solder Paste Painting: Used for SMD pads with special-shaped packaging and sensor metal shells.
  • Potting and Component Reinforced-Gluing: The GS600M Fully-Automatic Dispensing Machine is recommended for potting sensor cavities and reinforced-gluing of SMDs and chips.
Customers: The document does not specify customer details but implies a focus on industries requiring advanced packaging solutions.
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Catalog excerpts

Discrete Device Industry Application-1

INDUSTRY APPLICATION INDUSTRY APPLICATION Discrete Devices Mainly used in the field of discrete device packaging, including Leadframe Package, Substrate Package and Shell & Case Package, etc. Including processes such as Chip Coating, Solder Paste Painting, Potting, Component Reinforced-Gluing and Underfill. Recommended Products Chip Coating Solder Paste Painting Applied to encapsulation glue jetting process of ASIC chips, etc. Applied to Solder Paste Painting of SMD pads with special-shaped packaging, and Solder Paste Painting of sensor metal shells, etc. Component Reinforced-gluing Applied to Potting process of sensor cavities, etc. Applied to Reinforced-Gluing process of SMDs and Chips, etc. GS600M Fully-Automatic Dispensing Machine Underfill Applied to Underfill process of flip chips

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