Electronic Applications Division Now available: Printed copper metallizations RoHS COMPLIA Metallizing – go for a dependable foundation CeramTec is one of the leading manufacturers interna­ tionally of metallized substrates on aluminum oxide (Rubalit®) and aluminum nitride (Alunit®) bases. Over 30 years of experience in metallizing, and a worldwide presence with manufacturing and laser facilities in Europe, North America and Asia make us the qualified partner for the hybrid industry, electronic component manufacturers and the power electronics industry. We metallize our ceramic substrates in our specialist facilities using CeramTec developed pastes. Metallized ceramics for: • Power electronics, Power modules, rectifiers, thyristors, ignition elements • hermo-electrical applications, Peltier, heating and T cooling elements • Optoelectronics LED´s, optocouplers, photo diodes, photo transistors, reflex sensors, photo logic sensors • omponents: SMT-inductor cores, sensors C • ybrids: Special single-layer, substrates for H microelectronic, semiconductors Characteristics of CeramTec’s metallized substrates with their superior mechanical, electrical and thermal properties: • High adhesive strength • Good flux • Superior leaching resistivity • Excellent solderability com­pression welding

layer Design: The base layer is tungsten (W), screenprinted with a mini­ mum layer thickness of 6 µm. Both electroless and electrolytic nickel (Ni) plating (min. 2 µm) ensure a good solder flow, and Nickel Tungsten Ceramic an additional gold flash (Au) layer (~ 0.1 mm) can be added to enhance corrision resistance. We can also supply a bondable electrolytic gold layer or lead free tin for solder finishes. standard metallization: W/Ni/Au Ag/Pd, Ag/Pd/Pt Cu/Ni/Au, Cu/Ni/Pd/Au, Cu/Sn Refractory metallization system Other metallizations available on request. Standard dimension for metallization: rubalit®,...