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CeramCool® Substrates

CeramCool® Substrates
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Electronic Applications Division CeramCool® Substrates Wherever things get hot! The closer ceramic is placed to the heat source, the greater the cooling advantages it offers. This makes directly of the CeramCool system grow with the packing density, so it’s perfect for use wherever things get hot! metalized CeramCool substrates one of the most efficient options for efficient thermal management. The advantages • Most efficient area of heat dissipation • Cut the substrate surface in half! • Electrical insulation, thermal conductivity and • Double the power density! electrical circuit • Electrical circuits without thermal barrier directly on CeramCool • Ceramic PCB with lowest Rtt total thermal resistance • High break-through voltage

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Forget about it Ceramic CeramCool substrates are electri- reduces the thermal resistance of the PCB by cally isolating, thermally conductive and can be about 50%. With Alunit the thermal resistance metalized directly. No thermal barrier blocks is negligible, so you can forget about it and en- optimal heat dissipation. This makes them per- fect for replacing a conventional PCB IMS (insulated metal substrate). Using Rubalit substrates Increase the power density Reduce the thermal resistance Alunit MC-PCB • Rubalit: Cuts thermal resistance in half • Alunit: Thermal resistance is negligible...

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