Electronic Applications Division Advanced Ceramic Electronics Industry

Substrates Materials used for Stamping Ceramic base materials for the electronics industry We offer the full range of ceramic base materials • 96% Alumina - Rubalit®708S For thick- and standard thinfilm applications • 96% Alumina - Rubalit®HP For high thermal cycling performance Tolerances Property Standard dimensions Length and with (as red) tolerance Standard thicknesses Thickness tolerance Special thicknesses For highest quality thinfilm applications • Aluminiumnitride - Alunit® For high thermal power applications • Alumina with Zirkonia - Rubalit®HSS For high mechanical strength applications...

Functional Surfaces 1D, 2D and 3D metallization Materials Structured Copper Technology Rubalit® 708, Rubalit® 708S, Rubalit® 708HP, Rubalit® HSS, Property Specifications and parameters ceramic Standard Basic Standard ceramic materials Standard usable design area Metal layer thicknesses 17 µm up to 400 µm Layout related Other thicknesses on demand on demand 2 µm to 3 µm galvanic solder coating Double side metallization Options Vias Vialling Ni on ceramic NiCu on ceramik Dielectric layer Metallization Adhesion Solder wettability Layout and material combination related „Fine Line“ 6 sides on one...

3D Products Materials and surface quality Typical Ra Value as red Parameter and tolerances Standard tolerances Length and width (as red) Thickness Special tolerances Distance between holes (center distance) Overall camber (measured between parallel plates, 45°) Perpendicularity Parallelism Radii and corners 1 2 3 ± 0,5%1 quoted upon request Ϲ 0,2 mm but not less than +/- 0.1 mm but not less than +/- 0.05 mm but not less than +/- 0.076 mm Please see our data sheets for further information. Indexes and parameters for ceramic substances: In order indicated. The crystalline nature of these substances,...