Package Details Top View Bottom View Semiconductor corp. Mechanical Drawing SIDE VIEW * Exposed pad P internally connected to pins 3 and 4 Part Marking: 2-3 Character Alpha/Numeric Code Lead Code: Reference individual device data sheet. Mounting Pad Geometry (Dimensions in mm)

Package Details Semiconductor corp. Tape Dimensions and Orientation (Dimensions in mm) accordance with Electronic Industries Association Standard Packaging Base Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code, Ship Date and Marking Code. Reel Packing Information Ordering Information • For devices taped and reeled on 7" reels, add TR suffix to part number. • All SMDs are available in small quantities for prototype and manual placement applications.

D atenial ODD DDsitiaD DDecinieatiDD Semiconductor corp. Top View Bottom View ° *EMC GREEN molding compound is Halogen-Free. The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no guarantee to completeness or accuracy, as some information is derived from data sources outside the company.