Current Sense Resistors:Type CD
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Type CD Low Resistance Precision Chip Resistors Page 1 of 2 Low Resistance Chip down to 0.010Ω at ±1% with unique Pedestal Terminal Design for Current Sense in Hybrid and SMT Applications Type CD Low Resistance Precision Chip Resistors utilize the proven Caddock Micronox® resistance films to achieve the unique low resistance range in this family. The special performance features of the Type CD Low Resistance Precision Film Resistor include: • Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pedestals to receive aluminum wire bonds. Resistance as low as 0.010 ohm at ±1%. Pedestal terminals in this design provide an ultra low resistance connection pad which maintains the precision 0.010Ω ±1% at the point of customer Kelvin connection to the resistor chip. The pedestal terminal with its copper core also provides heat spreading which enhances the high power handling capability. Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. High pulse handling and overload capability. Low inductance provides excellent high frequency and pulse response. Style FC - Flip Chip Version Resistance Model is a surface mount version with solderable pedestal terminals for flip chip soldering. Power Capability Information General Applications High Power Applications Thermal Resistance - RθJC Power Rating Film (J) to Solder Pad (C) at 70° C (see note 2) (see note 1) Dimensions in inches and (millimeters) A Solderable Pedestal Solderable Pedestal Style FC Derating Curve For General Applications RATED LOAD, % Note 1: General Applications - The power rating for general applications is based upon 0.5 sq. in. (300 mm2) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150°C. Use Derating Curve to derate appropriately for the maximum ambient temperature and for the temperature limitations of the adjacent materials. Note 2: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and solder pad temperature at the center of the solderable pedestal (point X in the recommended circuit layout shown below). Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application. Recommended Circuit Board Layout (current and sense connections): Fig. 1A: Recommended Kelvin layout. C = Current connection S = Sense connection Applications Engineering 17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408 © 2003-2007 Caddock Electronics, Inc. CD2015FC Standard Resistance Values: Tolerance CD2015FC ±1% Standard. 0.010 Ω 0.015 Ω 0.020 Ω 0.025 Ω CD2520FC Standard Resistance Values: Tolerance CD2520FC ±1% Standard. 0.010 Ω 0.015 Ω 0.020 Ω 0.025 Ω Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering. Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown. e-mail: caddock@caddock.com • web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html Sales and Corporate Office 1717 Chicago Avenue Riverside, California 92507-2364 Phone: (951) 788-1700 Fax: (951) 369-1151 28_IL117.1004

Type CD Low Resistance Precision Chip Resistors Page 2 of 2 Style WB - Wire Bond Version is a hybrid mountable version with copper pedestal terminals and an aluminum surface layer for wire bonding. The back surface of these devices is metallized for solder attachment of the chip resistor to a heat sinking substrate. Power Capability Information Thermal Resistance RθJC Film (J) to Solder Pad (C) (see note 3) Dimensions in inches and (millimeters) B Note 3: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS,...