LAB family Equipment
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Equipment SPECIAL SYSTEMS Lab Family

Customer Benefit The H750 is an advanced horizontal sputter inline system in sputter-up configuration. It not only uses the state of the art stainless steel design but it is made for high throughput, low contamination levels of the substrates, quick service, extended uptime, and user friendly operation. The H750 is based on a modular concept and can be configured to match customer’s requirements. In the H750 substrates are placed on substrate carriers. These are manufactured according to customer’s substrates and can be exchanged during operation of the machine. For reliable operation of...

Applications The H750 offers a quality coating area of up to 550 mm x 600 mm at standard substrate carriers. Processes include substrate pre-treatment by means of a linear ion source and all different magnetron sputter processes available from Leybold Optics Dresden. These are DC sputter processes using magnetrons with high target utilization, MF sputter processes with dual magnetrons or even RF sputtering of insulating target materials.

SPECIAL SYSTEMS Inside dimension of the chamber (W x H x D in mm): LAB 500: 500 x 650 x 520 LAB 600: 600 x 750 x 620 LAB 600 H: 600 x 1100 x 620 LAB 700: 700 x 750 x 720 LAB 700 H: 700 x 950 x 720 LAB 900: 950 x 950 x 920 LAB 1100: 1100 x 1100 x 1050 LAB 1820: ø: 1820 / H: 1400 LAB 500 LAB 700 H LAB 600 LAB 900 LAB 600 H LAB 1100 LAB 700 LAB 1820

SPECIAL SYSTEMS GENERAL FEATURES: • high-grade steel vacuum chamber mounted on welded frame rack with height adjustable feet • two set of chamber liners (evaporation shields) • water cooled chamber walls • viewports with mirror observation system or shutter • Pirani and Bayard-Alpert Ionivac • pumping system according to the requirements • PLC based control system with PC visualisation ELECTRICAL CABINETS: • 2x or 3x 19” Rittal cabinet • main power distribution • PLC based control system with PC visualisation • Emergency Off Option: • customized electrical cabinets

SPECIAL SYSTEMS Vacuum

SPECIAL SYSTEMS Vacuum

PLC WITH TOUCH SCREEN 3 user level • Service • Supervisor • User MINI PLC Automatic control of: • vacuum pumps • process devices • optional equipment: Modem Data logging on CF-card Recipe handling • 20 recipes can be stored • fixed structure of header and up to 50 layers per recipe SPECIAL SYSTEMS Monochrome touch panel with 320 x 240 pixels Compact PLC OMRON SYSMAC CPM2A with directly connected in- and outputs Signals directly wired to PLC (no field bus system) Standard touch screen version 16 colours touch panel with 640 x 480 pixels Modular PLC OMRON SYSMAC CS1H with Profibus DP RS232...

LAB PLUS CONTROLER ADDITIONAL FEATURES COMPARED TO PLC WITH TOUCH SCREEN VERSION: • Better graphics resolution • Windows look and feel • 5 user levels • configurable data logging • Free recipe editing (drag and drop) • Recipes stored in Access database on PC • Up to 800 steps per recipe can be stored on PLC • Modem and Ethernet • process devices like OMS 3000 can be used PC version example screen shot SPECIAL SYSTEMS 19”-Rack Panel-PC in cabinet front or cabinet mounted Industrial-PC with separate mobile control desk for clean room installation with 15” or 18” TFT-Touch screen Modular PLC...

THERMAL EVAPORATION Thermal evaporator „big“ • high current feedthroughs up to 1000 A • special boat holder • high current transformer 1100 A / 12 V • special thyristor unit Thermal evaporator „small“ • Evaporation assembly • High current generator AS 053 (400 A with 5 V or 200 A with 10 V) High volume evaporator • ceramic heater with shielding • high volume Evaporator „big“ • Multi boat evaporator SPECIAL SYSTEMS Evaporator „small“ AS 053

ELECTRON BEAM EVAPORATION EGC 38 Electron-beam evaporator HPE 6 • max. power: 6 kW • deflection: 270° • 3 types: coaxial, standard, long • single, 4-6-7 cup Electron-beam evaporator ESV 14/4, ESV 14/D, ESV 14/Q • crucible: four-hearth rotary crucible (ESV 14/4) • 4 x 25 cm3 single hearth rotary crucible (ESV 14/D) • 1 x 100 cm3 exchangeable crucible plates (ESV 14/Q) • beam power at 10 kV: 10 kW • operating pressure: < 5 x 10-4 mbar • cooling water requirement: > 12 l/min; 4-7 bar Electron-beam evaporator EV M-6 and EV M-8 • max. power: 6 kW (EV M-6) or 10 kW (EV-M8) • acceleration voltage:...

ION AND PLASMA SOURCES End Hall ion sources • pressure range > 3·10-4 mbar • beam current up to 1000 mA • ion energy from 40 to 120 eV • filament or hollow cathode nutralizer ECWR plasma sources • pressure range > 1·10-4 mbar • plasma densities up to 1013/cm3 • ion current density up to 3 mA/cm2 • independent control of the ion energy from 20 to 600 eV RF ion source • RF power: 75 to 300 W at 13.56 MHz • beam current: up to 50 mA • ion energy: from 100 to 2000 eV MAGNETRON SPUTTERING Penning cathode PK 100 - 250 • wall mounted • magnetic array at athmosphere • water cooling integrated in...

QUARTZ MONITORING Thin film deposition controller IC/5 • control of up to 6 coating sources • co-deposition with two sources is possible • 50 coating programs with 250 different layers • 24 material programs • simultaneous measurement with up to 8 sensors • thickness resolution: ca. 1 Å • rate resolution: down to 0.1 Å /s Thin film deposition controller XTC/2 • two channels, but not simultaneously used • 9 coating programs with up to 3 different layers • 9 material programs • thickness resolution: ca. 1 Å • rate resolution: down to 0.1 Å /s OMS 3000 OPTICAL MONITORING Optical monitor OMS...