Cluster Systems Brochure
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SPECIAL SYSTEMS Clusters Systems

Introduction Leybold Optics Dresden designs and manufactures Cluster Systems according to customers requirements. These systems can employ physical vapour deposition (PVD), namely sputtering and evaporation as well as plasma cleaning and plasma enhanced chemical vapour deposition (PECVD). The Cluster Systems can be fully automatically controlled and utilize a robot for substrate handling and a wafer cassette loading chamber but can also be largely manually operated as for lower cost research and development applications. Substrates to be coated are usually silicon or glass wafers but the...

CLUSTEX 100M Customer Benefit The CLUSTEX 100M is a versatile lower cost magnetron sputter tool intended for the use in research and development. The system can be largely manually operated and easily be modified, providing maximum flexibility for process development. The CLUSTEX 100M can be equipped with various vacuum pumping systems depending on the intended application. Sputter chambers for use with single cathodes as well as chambers for multiple sources and substrates are available.

Process Equipment The process equipment to be used in the CLUSTEX 100M includes magnetrons up to 100 mm target diameter for use with DC or RF power. There are also plasma sources for use with inert and reactive gases available for the CLUSTEX. Other process options include substrate heaters, biased or rotary substrate holders, and cooling stations. Applications The CLUSTEX 100M has been successfully employed for metallization of wafers by means of DC magnetron sputtering deposition of dielectric films by means of RF sputtering cleaning and activation of substrates before coating ion beam...

Customer Benefit The CLAB series of systems represents Clusters that comprise an e-beam evaporation system and a magnetron sputter and/or ion beam treatment system. These fully automatically operated systems employ an automatic vacuum robot for substrate handling and one or two substrate loading stations for use with wafer cassettes. CLAB systems are designed to meet semiconductor industry standards and can be operated from the clean room side or from the grey room side during normal operation or during maintenance or service, respectively. CLAB 500ebsp

Process Equipment The process equipment implemented in the CLAB 500ebsp includes thermal and electron beam evaporators, also in combination with ion beam assistance installed in a LAB 500 chamber magnetrons up to 150 mm target diameter for use with DC or RF power implemented in a sputter chamber a plasma source for substrate cleaning implemented in a preparation chamber. Other process options include substrate heaters, biased or rotary substrate holders, and cooling stations. Applications The CLAB 500ebsp has been successfully employed for metallization of wafers by means of DC magnetron...

Customer Benefit The CLUSTEX 250 is a fully automatic magnetron sputter coating system with 250 mm diameter magnetrons for substrates up to 200 mm diameter. It employs an automatic vacuum robot for substrate handling, a substrate loading station with wafer cassette elevator, and a separate substrate cleaning and pre-treatment chamber. CLUSTEX 250 systems are designed to meet semiconductor industry standards and can be operated from the clean room side or from the grey room side during normal operation or during maintenance or service, respectively. CLUSTEX 250

Process Equipment The process equipment implemented in the CLUSTEX 250 includes magnetrons with 250 mm target diameter for use with DC or RF power increased source to substrate distance option rotary substrate table for improved coating uniformity RF parallel plate plasma etcher for substrate cleaning implemented in a preparation chamber. Other process options include substrate heaters, biased substrate holders, and cooling stations. Applications The CLUSTEX 250 has been successfully employed for metallization of 8 inch diameter wafers by means of DC magnetron sputtering deposition of thin...

Technical Features Overview CLUSTEX 100M • manually operated R&D cluster tool • manual substrate loading and transfer • magnetron sputtering with DC and/or RF power • metallic or reactive sputtering • target size up to 100 mm diameter • oil sealed or dry vacuum pumping systems • turbo molecular high vacuum pumps

CLAB 500ebsp CLUSTEX 250 • fully automatic high vacuum coating cluster tool • combination of e-beam or thermal evaporation and magnetron sputtering in one cluster • robotic substrate loading and transfer • magnetron sputtering with DC and/or RF power • metallic or reactive sputtering • ion beam or plasma cleaning of substrates • oil sealed or dry vacuum pumping systems • turbo molecular or cryogenic high vacuum pumps • installed through a clean room wall • fully automatic high vacuum magnetron sputter cluster tool • robotic substrate handling with wafer cassette elevator in loading chamber...

CHINA LEYBOLD OPTICS CHINA #25, Kangsheng Industrial Park No.11 Kangding Street Beijing BDA, 100176, China Phone: +86 10 67803366 - 0 Fax: +86 10 67803366 - 100 FRANCE LEYBOLD OPTICS FRANCE 7 Avenue du Quebec 91140 Villebon sur Yvette Z.A. de Courtaboeuf, France Phone: +33 1 698248 - 12 Fax: +33 1 698248 - 40 GERMANY LEYBOLD OPTICS DRESDEN Zur Wetterwarte 50 Haus 303 01109 Dresden, Germany Tel.: +49 351 86695 - 16 Fax: +49 351 86695 - 42 GREAT BRITAIN / IRELAND LEYBOLD OPTICS UK St. Modwen Road, Stretford Manchester M32 OZE, Great Britain Phone: +44 161 86628 - 00 Fax: +44 161 86628 - 01...