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CG0402MLU/ CG0603MLU

CG0402MLU/ CG0603MLU
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■ Digital Visual Interface (DVI) ■ Memory protection ■ SIM card ports ■ Automotive ChipGuard® MLU Series - ESD Protectors General Information Device Symbol The ChipGuard® MLU Series has been speciﬁcally designed to protect sensitive electronic components from electrostatic discharge damage. The MLU family has been designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD speciﬁcations targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. The ChipGuard® MLU Series has been manufactured to provide low 0.05 pF capacitance and leakage currents less than 5 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics @ 25 °C (unless otherwise noted) CG0402MLU / CG0603MLU (Note 3) Parameter Typical Continuous Operating Voltage Typical Clamping Voltage (Note 1) Maximum Leakage Current @ Max. VDC Typical Trigger Voltage (Note 2) Maximum ResponseTime Maximum Capacitance @ 1 VRMS 1 MHz ESD Protection: Per IEC 61000-4-2 Min. Contact Discharge (>1000 Reps) Min. Air Discharge (>1000 Reps) Operating Temperature Storage Temperature TOPR TSTG Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. Part number sufﬁx “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Speciﬁcations are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device per

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ChipGuard® MLU Series - ESD Protectors Product Dimensions Solder Reﬂow Recommendations 300 Ambient to Preheating Temperature Main Heating Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Speciﬁcations are...

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ChipGuard® MLU Series - ESD Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) NOTES: TAPE MATERIAL IS PAPER. 0.60 ± 0.05 TAPE THICKNESS IS (0.024 ± 0.002) COVER TAPE ADHESION IS 40 ± 15 GRAMS. ChipGuard Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage** 3.3 = 3.3 V 05 = 5 V 12 = 12 V 24 = 24 V Tape & Reel Packaging E = 5,000 pcs. per reel (0603 Package) G = 10,000 pcs. per reel (0402 Package) ** Only models lower than 10 volts require decimal point. REV. K 06/13 Speciﬁcations are subject to change without notice....

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