n Rated for IEC 61000-4-2, level 4 n Withstands multiple ESD strikes n Low capacitance and leakage currents for invisible load protection n Tape and reel packaging ChipGuard® MLD Series Varistor ESD Clamp Protectors The Chip Guard® CG0402MLD and CG0603MLD Series have been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLD family has been designed to protect equipment to IEC61000-4-2, level 4 ESD specifications targeted for high speed data applications. The Chip Guard® MLD Series has been manufactured to provide very low capacitance with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics @ 25 °C (unless otherwise noted) Continuous Operating Voltage Breakdown Voltage Clamping Voltage Off-state Current ESD Withstand Ratings Peak Voltage ESD Voltage Capability, Contact Discharge ESD Voltage Capability, Air Discharge CG 0n0n MLD - 12 x ChipGuard® Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 12 = 12 V Tape & Reel Packaging E = 4,000 pcs. per reel (CG0603MLD Series) G = 10,000 pcs. per reel (CG0402MLD Series) Ni barrier terminations are standard on all ChipGuard® part numbers. Asia-Pacific: Tel: +886-2 2562-4117 • Email: [email protected] EMEA: Tel: +36 88 520 390 • Email: [email protected] The Americas: Tel: +1-951 781-5500 • Email: [email protected] www.bourns.com *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specifi

ChipGuard® MLD Series Varistor ESD Clamp Protectors 3312 - 2 mm SMD Trimming Potentiometer W Product Dimensions Solder Reflow Recommendations 300 Ambient to Preheating Temperature Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts...

ChipGuard® MLD Series Varistor ESD Clamp Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) NOTES: TAPE MATERIAL IS PAPER. 0.48 ± 0.03 TAPE THICKNESS IS (0.019 ± 0.0012) COVER TAPE ADHESION IS 40 ± 15 GRAMS. REV. I 05/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device