Bourns® Integrated Passive & Active Devices
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Bourns® Integrated Passive & Active Devices - 1

Integrated Passive & Active Devices Short Form Catalog

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Bourns® Integrated Passive & Active Devices - 2

Thin Film On Silicon Products Bourns can now provide designers with an integrated passive & active device solution that saves PCB real estate while offering remarkable electrical performance. The designers of compact electronic systems, especially handheld/wireless devices, are faced with tightening board space constraints, driving the requirement for alternative passive & active component technologies. In the last several years, there has been somewhat of a revolution in the I.C. packaging world with the birth of a generation of extremely space-efficient packaging solutions. Using Thin...

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Bourns® Integrated Passive & Active Devices - 3

R Networks Product Selection Guide • Multiple Resistors • Stable TFOS Technology • JEDEC Standard Packages • Base stations • Computers & Peripherals • Instrumentation Package Schematic Package Schematic Package Schematic R1 Value R2 Value Resistance (ohms) (ohms) Code 10 K 20 K 103 25 K 50 K 253 How to Order 2 QSP 16 - T J 1 -472 LF Product Class Thin Film On Silicon Standard Package Styles QSP = QSOP NBS = Narrow Body SOIC Pin Count QSP = 16, 20, 24, 28 NBS = 8, 14, 16 Dispensing R = Reel T = Tube Tolerance J = ±5 % G = ±2 % F = ±1 % Circuit Configuration 1 = Isolated Resistors 2 = Bussed...

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Bourns® Integrated Passive & Active Devices - 4

RC Networks Product Selection Guide • RC Configuration • Stable TFOS Technology • JEDEC Standard Packages • Base stations • Computers & Peripherals • Instrumentation Package Schematic Package Schematic Package Schematic Package Schematic Product Class Thin Film On Silicon Product Class Thin Film On Silicon Standard Package Styles CFA = Tapped RC Filter CFB = T-Filter CTA = AC Terminator Product Function CTE = IEEE 1284 Terminator Resistance Value Code 1st two digits are significant 3rd digit = number of zeros to follow to give resistance value in ohms Capacitator Value Code 1st two digits...

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Bourns® Integrated Passive & Active Devices - 5

RCD Networks Product Selection Guide • RCD Configuration • Stable TFOS Technology • JEDEC Standard Packages • ESD Protection: IEC61000-4-2 • Bidirectional Parallel Port Communications • Computers & Peripherals • Instrumentation 2DTG Super Terminator/Filter/Diode Array Package Schematic Package Schematic No. of SMT Package Lead/Bumps Channels QSOP QSOP QFN QFN CSP CSP Bidirectional Filter

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Bourns® Integrated Passive & Active Devices - 6

RCD Networks Product Selection Guide • RCD Configuration • Stable TFOS Technology • JEDEC Standard Packages • ESD Protection: IEC61000-4-2 • Bidirectional Parallel Port Communications • Computers & Peripherals • Instrumentation Package Schematic 2FAH ESD & EMI Filter Array Package Schematic Package Schematic Package Schematic Package Schematic Package Schematic No. of SMT Package Lead/Bumps Channels CSP DFN CSP DFN CSP QFN QFN CSP DFN CSP CSP Bidirectional Filter

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Bourns® Integrated Passive & Active Devices - 7

Diode Networks Product Selection Guide • Diode Array • Stable TFOS Technology • JEDEC Standard Packages • Bidirectional Parallel Port • Computers & Peripherals Package Schematic Package Schematic Package Schematic Part Number SMT Package Lead/Bumps Channels pF

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Bourns® Integrated Passive & Active Devices - 8

Available Packages QSOP Package NBSOIC Package Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate. Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate.

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Bourns® Integrated Passive & Active Devices - 9

CSP Package – 16 I/O BUMP A1/PIN 1 INDICATOR 858 ± 40 (33.78 ± 1.57) BOURNS LOGO BOURNS LOGO Governing dimensions are in microns. Dimensions in parentheses are in mils. Governing dimensions are in microns. Dimensions in parentheses are in mils.

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Bourns® Integrated Passive & Active Devices - 10

Available Packages, continued DFN Package – 12 I/O

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Bourns® Integrated Passive & Active Devices - 11

Application Solutions Cell Phone/PDA LCD Screen Interface (ESD, EMI Filter, Low Capacitance ~20pF) Cell Phone/PDA External Port Interface (ESD, EMI Filter) External Port Internal Circuit Parallel I/O Port (RC Filter, Bidirectional) IEEE 1284 I/O Port (RC Filter, R Pull Up to VCC) VCC External Data Port Internal Circuit External Data Port Cell Phone/PDA External Port Interface (ESD, EMI FIlter, Low Capcitance ~20pF) I/O 1 GND I/O 1 External Port Internal Circuit Internal Circuit

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Bourns® Integrated Passive & Active Devices - 12

Worldwide Sales Offices Non-Listed European Technical Assistance Bourns" products are available through an extensive network of manufacturer's representatives, agents and distributors. To obtain technical applications assistance, a quotation, or to place an order, contact a Bourns representative in your area. Specifications subject to change without notice. Actual performance in specific customer applications may differ due to the influence of other variables. Customers should verify actual device performance in their specific applications. Reliable Electronic Solutions "Bourns" is a...

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