Catalog excerpts
High Power UV-C LED S3535-H-DR350-265nm LED Specifications BOLB Inc. Livermore, California V1.2A July 2024
Open the catalog to page 1RISK GROUP 3 WARNING UV EMITTED FROM THIS PRODUCT AVOID EYE AND SKIN EXPOSURE TO UNSHEIELDED PRODUCT AVERTISSEMENT UV émis par ce produit. Éviter l'exposition des yeux et de la peau à un produit non protégé ADVERTENCIA Emisión de rayos ultravioleta por este producto. Evite la exposición de los ojos y la piel al producto sin protección 警告 この製品から放出される紫外線。シールドされていない製品への目や皮 膚の露出を避ける CAUTION – RISK OF PERSONAL INJURY. THIS LED PACKAGE IS NOT INTENED FOR GENERAL ILLUMINATION AND MAY REQUIRE THE USE OF SPECIAL SAFEGUARDS. INSTALL AND USE ONLY IN STRICT ACCORDANCE WITH THE PRODUCT AND PACKAGING...
Open the catalog to page 2S3535-H-DR350-265nm LEDs Specifications 1. Identification Convention SMD type 3535 package Nominal drive current (mA), often omitted S3535-H-DR350-Wavelength--Power--Voltage Hemispherical Lens Interpretation: Surface Mount type 3.5 mm x 3.5 mm packaged LED with Hemispherical Lens Nominal Drive Current = 350 mA Peak wavelength = 265 (260-270 nm) for L0 bin Power output @ 350mA = 160-180 mW for U2 bin Forward voltage @ 350mA =6.5-7.5 V for V2 bin info@bolb.co WWW.BOLB.CO Product specifications subject to change without notice
Open the catalog to page 3S3535-H-DR350-265nm LEDs Specifications 2. S3535-H UVC LEDs package diagrams All units in mm External dimension tolerance: ± 0.1 mm Internal dimension tolerance: ±0.05 mm Front-side anode Marks Bottom view Side view Back-side cathode mark Recommended Solder Pattern on PCB Special note: This product includes a Zener/TVS chip. Specifications Subject to Change without notice
Open the catalog to page 4Hex 3535H drawing All sizes in mm Zierick 1301 connector x2
Open the catalog to page 5S3535-H-DR350-265nm LEDs Specifications 3. Absolute Maximum Ratings at Ta=25oC Parameter Forward Current Power Dissipation Operating Temperature Storage Temperature Junction Temperature Electrostatic Discharge 4. Typical Optical Electrical Parameters at Ta=25oC[7] Parameter Spectrum Half Width Forward Voltage Notes: 1. Peak Wavelength Tolerance ± 2nm 2. Radiant Flux Measurement tolerance ±10% 3. Forward Voltage Tolerance ± 3% 4. View angle Tolerance ±10º 5. Rth j-b is the thermal resistance from chip junction to bottom of MCPCB including thermal grease measured at 350mA 6. Reference for...
Open the catalog to page 65. Characteristic diagrams at Ta=25oC Figure 1. Typical Current-Voltage Relationship Figure 2. Relative radiant flux vs. forward current 120% Relative intensity % Figure 4. Typical spectrum Figure 3. Peak wavelength vs. temperature Solder Point Temperature, Solder Point Temperature, Figure 6. Radiant Flux vs. solder point temperature Figure 5. Voltage vs. solder point temperature Solder Point Temperature,
Open the catalog to page 7Figure 7. Far-field Emission Pattern (Intensity vs. Emission Angle) Relative Intensity *Values based on standard Bolb test conditions 30°C +/- 2°C solder-point temperature Subject to change: please inquire about latest update Additional Testing and Certifications: o Moisture Sensitivity Test: MSL Rating 5 o BOLB LEDs are RoHS and REACH compliant o Bolb LEDs produce zero ozone
Open the catalog to page 8S3535-H-DR350-265nm LEDs Specifications 7. Binning Information [ Ta =25℃, IF = 350mA] Designate[1] Note: 1. Bin code definitions are as follows: Peak Wavelength = W ; Radiant Flux = P ; Forward Voltage = V 2. * These are the dominant bins. Delivery time maybe longer for other bins, if available.
Open the catalog to page 9S3535-H-DR350-265nm LEDs Specifications 8. Target Surface Irradiance as a Function of Distance Normalized to 150 mW Output Power Irradiance Values (±5%) LED Device Distance to Irradiance Target Plane Unit (cm) Irradiance on-axis Note: 1. Radiometers calibrated for the 253.7 nm main emission of mercury lamps require recalibration for 265 nm UVC emission; 2. Silicon carbide photodetectors are preferred over silicon alternatives, eliminating the need for frequent recalibration due to their superior resistance to degradation under intense UVC exposure.
Open the catalog to page 10S3535-H-DR350-265nm LEDs Specifications 9. Irradiance-Distance Plots for the SMD 3535-H Normalized to 150 mW Output power 40 60 80 100 On-axis Distance to Target Plane, cm 40 60 80 100 On-axis Distance to Target Plane, cm
Open the catalog to page 11S3535-H-DR350-265nm LEDs Specifications 10. Solder Reflow Temperature Profile Lead-free soldering process parameters Reflow Steps Average heating rate ( TL to TP ) Minimum value of preheating temperature T smin Maximum preheating temperature T smax Warm-up time t s Reflow zone maintenance temperature T L Reflow zone holding time t L Peak temperature T P t P within 5°C of actual peak temperature Time from 25°C (normal temperature) to peak temperature
Open the catalog to page 12S3535-H-DR350-265nm LEDs Specifications 10. Solder Reflow Temperature Profile (continued) Soldering Guidelines 1.Reflow Temperature: Optimize settings based on solder paste properties, equipment specifications, and PCB characteristics. 2.Soldering Methods: 1. Reflow soldering: Maximum 2 cycles permitted 2. Manual soldering: Maximum temperature 300°C for 2 seconds, single application only 3.Cooling: Gradual cooling from peak temperature recommended. 4.Process Curves: Provided curves are reference guidelines. Optimize based on specific application requirements. 5.Lead-Free Reflow Profile:...
Open the catalog to page 13S3535-H-DR350-265nm LEDs Specifications 11. Reliability (1) Test and results Test Resistance to Soldering Heat (Reflow Soldering) Reference Standard Test Conditions Test Duration Failure Criteria # High Temperature Storage Room Temperature Operating Life Test Board: See Notes Below Ta=60oC, If=350mA, High Temperature Operating Life Test Board: See Notes Below Ta=10oC, If=350mA, Low Temperature Operating Life Test Board: See Notes Below HBM, KV, kΩ, p JEITA ED-4701 300 F 3 pulses, 304 alternately positive or negative
Open the catalog to page 14S3535-H-DR350-265nm LEDs Specifications (2) Failure Criteria Criteria # Failure Criteria Forward Voltage(Vf) Storage and Handling Notes 1. Moisture Sensitivity: LEDs are moisture-sensitive; store in sealed, moisture-proof packaging; 2. Assembly Window: Solder LEDs to PCBs within 24 hours of opening moisture-proof packaging to ensure optimal performance; 3. Extended Storage: For unused LEDs after 48 hours, store in a nitrogen-purged dry box to maintain quality.
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