High Power UV-C LED 6060 SMD
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High Power UV-C LED Product Specifications 6060 SMD Packaged LEDs BOLB Inc. Livermore, California V1.86 September 2021

RISK GROUP 3 WARNING UV EMITTED FROM THIS PRODUCT AVOID EYE AND SKIN EXPOSURE TO UNSHEIELDED PRODUCT AVERTISSEMENT UV émis par ce produit. Éviter l'exposition des yeux et de la peau à un produit non protégé ADVERTENCIA Emisión de rayos ultravioleta por este producto. Evite la exposición de los ojos y la piel al producto sin protección 警告 この製品から放出される紫外線。シールドされていない製品への目や皮 膚の露出を避ける CAUTION – RISK OF PERSONAL INJURY. THIS LED PACKAGE IS NOT INTENED FOR GENERAL ILLUMINATION AND MAY REQUIRE THE USE OF SPECIAL SAFEGUARDS. INSTALL AND USE ONLY IN STRICT ACCORDANCE WITH THE PRODUCT AND PACKAGING...

6060 SMD Packaged LED Identification Convention SMD6060 type package Nominal drive current (mA), often omitted S6060-DR250-Wavelength--Power--Voltage Interpretation: Surface Mount type 6.0 x 6.0 mm packaged LED Nominal Drive current = 250 mA Peak wavelength = 275 +/- 3 nm Power output @ 250mA = 100 mW (+/-10mW) Forward voltage @ 250mA = 6.5V (+/- 0.5V) info@bolb.co WWW.BOLB.CO Product specifications subject to change without notice

1 Anode (+) Do not apply pressure to the dome lens on packaged LEDs Bottom view Recommended Solder Pattern on PCB Specifications Subject to Change without notice

SMD LED on Hex MCPCB All sizes in mm Connectors (x2) Attach heatsink here Same popular MCPCB format for visible LEDs Eliminates reflow soldering Plug-n-play with 0.025” wires (AWG 24 or 25) Larger contact area for heat extraction Nomenclature example: Hex-S6060-DR250-W275-P

TABLE 1. Typical Performance at 250mA (25°C ambient, packaged, Solder point temperature <38°C) Parameter Peak Wavelength Radiant Flux Forward Voltage Spectrum Half Width View Angle Thermal Resistance TABLE 2. Maximum Ratings (25°C ambient, packaged device) Parameter Maximum DC Drive Current Maximum Pulsed Drive Current Maximum Reverse Voltage Maximum Junction Temperature Operating Temperature Limits Storage Temperature Specifications subject to change with

FIG 1. Forward Current vs. Forward Voltage FIG 3. Peak Wavelength vs. Forward Current [Ta=25°C] Fig 5. Forward Voltage vs Ambient Temperature [IF=250mA] FIG 2. Relative Radiant Flux vs. Forward Current Fig 6. Relative Radiant Flux vs Ambient Temperature [IF=250mA]

UVC LED: Electro-optical parameters (continued) Fig 7. Far-field Emission Pattern （Relative Intensity vs. Emission Angle) Diagram for Hemispherical Lens LED Only TABLE 3. Device lifetime (forward current =250mA, TS < 38°C) Parameter *Values based on standard Bolb test conditions 38°C +/- 2°C solder-point temperature *Subject to change: please inquire about latest update Additional Testing and Certifications: o Moisture Sensitivity Test: MSL Rating 5/5A o BOLB LEDs are RoHS and REACH compliant o Bolb LEDs produce zero ozone

UVC LED: Electro-optical parameters (continued) TABLE 3. Bin Structures Note: * Dominant bin color coded purple Designate Peak Wavelength Note: Bin Code (W-P-V): Peak Wavelength = W ; Radiant Flux = P ; Forward Voltage = V

Typical Intensity Distribution of SMD6060 with Hemispherical Lens Short Distance Intensity Data Half Intensity Zone ~50ᵒ subtended angl

Intensity Distribution of SMD6060 with Tall lens Intensity Distribution of SMD6060 long distance Long Distance SMD6060 Intensity Distribution Intensity Linearly Scales with LED Output Power Intensity (μW/cm²)

FIG 8. Solder reflow temperature profile Time (sec.) Reflow Soldering Instructions SnBiAg alloy (Melting Temperature=138℃) Pre-Heating Pre-Heat Time Peak Temperature Time at Peak Temperature 10 sec recommended 300 sec. Max. for large arrays • Recommended solder composition: SnBiAg alloy or 174-T4 soldering paste) • Recommended stencil thickness is 60~80um • Recommended stencil solder paste area is 60~80% • Forming gas (5%-7%H2 in N2) ambient recommended for best results • After reflow soldering, Rapid cooling should be avoided • When soldering, do not use a none calibrated hot plate. A...

Handling Precautions ESD Protection Workplace setup should follow the recommendations given in JEDEC standard document JESD625B “Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices” or IEC 61340-5-1,2 and 3. The operators should be properly trained to handle UVC flipchips according the guidelines listed below: • Always wear conductive wrist straps that is continuously monitored when working or handling assembled boards containing unprotected chips. • Use an ion blower to neutralize the static discharge that may build up on the surface of the UVC flipchips during...

Packing Carrier Tape & Reel Dimensions (unit = mm) 180mm Reel Quantity 500 units/reel Cover tape adhesion <0.7 Newtons Leader tape > 35 empty pockets Trailer > 40 empty pockets

General Precautions and UVC Safety WARNING UV emitted from this product. Avoid eye and skin exposure to unshielded product AVERTISSEMENT UV émis par ce produit. Éviter l'exposition des yeux et de la peau à un produit non protégé ADVERTENCIA Emisión de rayos ultravioleta por este producto. Evite la exposición de los ojos y la piel al producto sin protección 警告 この製品から放出される紫外線。シールドされていな い製品への目や皮膚の露出を避ける UVC LEDs emit deep ultraviolet radiation, with extremely high intensity near their surface. This allows rapid disinfection but safety precautions must be observed during assembly, testing and...