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SMD-Terminal block - Mini-Flex
1 /3Pages

SMD-Terminal block - Mini-Flex

SMD-Terminal block - Mini-Flex
1 /3Pages

Catalog excerpts

SMD-Terminal block - Mini-Flex-1

SMD-Terminal block - Mini-F Lex General note: It is recommended to make an electrical connection between both poles of each polarity on the solder pad. pkg. wt. part no.1800 0,2 g 46.131.1001.50 SMD-Terminal block - Mini-Flex with push wire contacts and contact opening function 1 pole Direct insertion of solid and stranded, tinned wire ends and finely stranded conductors by using the contact opening function Contact opening function - also for release of already inserted wires Mounting and wiring position: PCB top side Machine-compatible "tape-and-reel" packaging Fixing: Lead-free reflow soldering according to DIN EN 610760-1, section 6 Material: Housing: PPA, white Contact material: CuNi Contact surface: hot-dipped tinned 5-10 pm To operate the contact opening function, we recommend the use of our tooLs 46.131.U801.89 or 46.131.-398.50 Recommended dimensions for solder tags Integrated stripping function for wire ends cut but not stripped This page is only valid in connection with the general information at www.bjb.com/en/General-information-Products and further information of the specific product at www.bjb.com.

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SMD-Terminal block - Mini-Flex-2

LED - Light and connection technotogy SMD-Terminal block - Mini-Flex General technical information Connection data Temperature data This page is only valid in connection with the general Information at www.bjb.com/en/General-Information-Products and further Information of the specific product at www.bjb.com.

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SMD-Terminal block - Mini-Flex-3

LED - Light and connection technotogy SMD-Terminal block - Mini-Flex Instructions for processing Instructions for soldering process Suitabte for leadfree-reflow-profiles according to DIN EN 61760-1 respective DIN EN 60068-2-58 up to peak-temperature of max. 260°C. Due to different application-specific parameters (component arrangement and alignment, soldering system, solder paste), it is recommended to use test runs to determine a suitable profile under production conditions. Depending on the SMD soldering process and associated parameters a minor discoloration might occur. However, this will...

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