Company Overview

Beijing Torch Co., Ltd is a professional electronic assembly service provider based in Beijing, China. They offer a range of equipment and services including manual, semi-automatic, and fully automatic screen printers and chip mounters, reflow ovens, wave soldering, X-ray inspection, microscopes, and production line consumables.

Manufacturing Process

The LED production line process includes three main steps: semi-automatic stencil printing, automatic mounting (pick and place), and reflow soldering. The stencil printer applies solder paste on PCB pads, the pick and place machine positions components, and the reflow oven melts and solidifies the solder paste to complete the soldering.

Semi-Automatic Screen Printer (Model: T1200LED)

Features

• High precision Japanese motor and linear guide rail for stable scraper seat.
• Double squeegees with adjustable pressure and speed control to avoid resonance.
• Adjustable squeegee seat that can tilt 45° for easy cleaning and maintenance.
• Movable printing head for precise alignment with stencil and frame.
• Stable working platform with micro-adjustment handles for fine tuning.
• Adjustable machinery arm to accommodate PCB sizes from 650 to 1200 mm.
• Groove and positioning pins for quick sample setup and board size changes.
• Fast and accurate X, Y, Z axis correction using steel working arm and stable board.
• PLC controlled electronic movement with human-machine interface supporting manual or automatic printing modes.

Technical Parameters

• Max PCB print size: 1200 x 300 mm
• Working platform size: 1200 x 300 mm
• Max frame size: 1300 x 550 mm
• Min frame size: 330 x 370 mm
• Micro-adjustment range: ±10 mm (X, Y), ±30° (rotation)
• Power supply: AC 220V, single phase, 50 Hz
• Dimensions: 1850 x 890 x 1760 mm

LED Automatic Chip Mounter (Model: LED640)

Features

• High precision stepper motor with industrial belt and precision guide rail.
• Servo motor with ball screw for accurate LED pick and place.
• Visual programming for automatic setup without manual coordinate input.
• Supports display and adjustment of up to 10 panel board coordinates.
• Selectable mounting areas on panel boards and offset correction for PCB defects.
• XYZ axis movement limits and 6-speed settings.
• Vacuum absorption platform supporting flexible light strips (FPC).
• Built-in vacuum pump reduces noise and power consumption.

Standard Configuration

• Industrial computer (1 set)
• Mounting heads (4 units)
• Nozzles (4 pcs, different sizes)
• Vacuum absorb platform (1 unit)

Optional Parts

• Automatic feeders (8mm, 12mm, 16mm, 24mm)
• Additional nozzles

Technical Parameters

• Max PCB size: 1200 x 350 mm
• Max movement range: X=1500 mm, Y=410 mm, Z=15 mm
• Typical mounting speed: 8,000–9,600 components per hour (cph)
• Max mounting speed: 12,000 cph
• Mounting accuracy: ±0.1 mm
• Supported components: 0603 size and above SMD and LED
• Programming: Automatic data import, video study, keyboard input
• Operating system: Windows XP
• Power supply: 220V, 50Hz, 4 kW
• Weight: 360 kg
• Dimensions: 2600 x 680 x 1500 mm

Lead-Free Hot Air Soldering System (Models: A8, A8N, A10, A10N)

Features

• International brand electrical components with advanced temperature control for stable and even heating, suitable for CSP and BGA soldering.
• Energy-saving inner oven design with heat insulation reduces power consumption by approximately 40% compared to common machines.
• Self-developed software provides real-time PCB temperature monitoring, data analysis, and printing.
• Independent PID control for each heating zone ensures temperature accuracy and uniformity.
• Fast warm-up time (~20 minutes from room temperature).
• Imported high-speed motor with stable airflow and low vibration/noise.
• Chain and belt synchronous transmission with variable speed control.
• Durable aluminum rail system with automatic lubrication.
• Industrial computer with Windows OS for easy operation.
• Power-off protection to prevent PCB damage during outages.
• PC and PLC communication using PC/PPI protocol for stable operation.
• Automatic work state monitoring and display.
• Forced air cooling with efficient cooling head design.
• Optional circulating water cooling and nitrogen flow meter for enhanced soldering quality.
• Optional nitrogen supply system with vertical nitrogen curtain to prevent leakage.
• Safety features include jacking cylinder and safety rod support.

Technical Parameters Summary

Additional Notes: Nitrogen consumption is 20-30 m³/h with oxygen density maintained at 300-500 PPM. The system supports fast nitrogen supply and vertical nitrogen curtain to prevent leakage (optional on A8 models).

Summary of Critical Information

• The company provides a comprehensive LED assembly line solution including stencil printing, chip mounting, and lead-free reflow soldering.
• Equipment features emphasize precision, stability, energy efficiency, and user-friendly operation.
• Technical parameters define maximum PCB sizes, speed, accuracy, and power requirements critical for production planning.
• Optional features such as nitrogen atmosphere and advanced cooling improve soldering quality and energy savings.
• All machines support flexible production needs with adjustable settings and modular components.