X Becomes Z The High- peed Solution on Die Bonder 2100

Product catalog summary

Introduction
Esec, a leader in die attach technology, introduces the Die Bonder 2100, featuring the innovative Z-Pattern© for small die bonding. This new pattern enhances throughput and quality, setting new industry standards.

Z-Pattern© Technology
The Z-Pattern© is designed for small die sizes ranging from 0.8-1.5 mm. It combines the quality of a cross pattern with the speed of a single dot pattern, resulting in faster and more stable dispensing processes. The Z-Pattern© reduces tail breaking time and simplifies control, making it a superior alternative to traditional patterns.

Performance Comparison
A comparison of dot, cross, and Z-Pattern© shows that the Z-Pattern© offers competitive production speed, improved tailing, and excellent epoxy coverage and symmetry. This pattern is implemented in the Die Bonder 2100 platform to optimize small die bond quality and throughput.

Benefits and Innovation
Esec's Z-Pattern© technology provides economic advantages and supports future industry advancements. The company's focus on market trends and customer collaboration ensures that its products remain at the forefront of technology.

About Esec
Founded in 1968, Esec specializes in die attach and wire bonding technologies. The company is recognized for its innovative solutions in the semiconductor and microtechnology industries, supported by a global network of customer support centers.

Contact Information
The document provides contact details for Esec's global network, including offices in South East Asia, China, South Korea, Taiwan, Europe, and the Americas.

Catalog excerpts

X Becomes Z The High- peed Solution on Die Bonder 2100-1

X Becomes Z The High-Zpeed Solution on Die Bonder 2100

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Achieving Die Bonding Quality at Unreached Throughput on Esec’s Die Bonder 2100 As one of the leaders in die attach for more than two decades, Esec is committed to surpassing its customers’ needs by constantly setting new industry standards in die attach. With its latest die attach platform, the revolutionary Die Bonder 2100, Esec demonstrates time and time again its innovation strength. As the first in the industry, Esec introduces the Z-Pattern© for small die bonding in the range of 0.8-1.5 mm, achieving unbeatable UPH rates. The new process combines the strengths of both, the process quality...

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X Becomes Z The High- peed Solution on Die Bonder 2100-3

Cross Pattern Print/Write time Tail breaking time Dispense Process time Rating Production speed Tailing Epoxy symmetry Epoxy coverage & fillet © Patent pending. Copyright by Esec Ltd., 2010. All rights reserved.

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To the limits. And beyond. Shaping Future Trends in Assembly and Packaging Esec has unique and extraordinary capabilities in the field of assembly and packaging. We continue to be the trend-setter in technology and in support of future advancements. And we will keep contributing to the positive development of the industry. This is where we differentiate ourselves and drive future growth. Our customers benefit from economical advantages provid d by our unique e technology and innovation concepts that are incorporated into our highly competitive products. Driving Innovation Strength As technology...

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