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Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool

Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool
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Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool - 1

Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool Future Proof Equipment Besi introduces an advanced solution for the Wettable Flank surface mount. A wettable flank is a specific design in which the mounting edge of an IC has a fillet that allows you to see and test that a proper connection has been made on a pad that is for the most part not visible once it is attached to a leadframe or board. This allows better inspection of packages such as QFNs Immersion Tin Solder fillet after assembly with AOI (Automated Optical Inspection). • Total solution, equipment with process solution from chemical partner Sytron. • Auto Catalytic Immersion Tin to ensure reliable AOI (Automated Optical Inspection) after board mounting of packages (no leadframe thickness limitation). • Lower cost alternative for step-cut or dimple to achieve wettable flanks (Best Cost of Ownership guarantee). • Fully covered cut side walls (no exposed Copper). • Fully automated Tape ring handling from standard cassettes (up to 12 inch). • Autocatalytic Immersion Sn process. • Passes solderability tests according JEDEC J-STD-002E. • Passes 8 hours steam aging test and 16 hour bake @ 155⁰C (surpasses Jedec standard)

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