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BE Semiconductor Industries N.V.
Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool

Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool

Product catalog summary

Introduction to Wettable Flank Plating
Besi introduces an advanced solution for Wettable Flank surface mount technology. This design allows for better inspection of IC packages, such as QFNs, using Automated Optical Inspection (AOI).

Key Features and Benefits

Total Solution: Equipment comes with a process solution from chemical partner Sytron.
Auto Catalytic Immersion Tin: Ensures reliable AOI after board mounting without leadframe thickness limitations.
Cost Efficiency: Offers a lower-cost alternative to step-cut or dimple methods, guaranteeing the best cost of ownership.

Future Proof Equipment

Fully covered cut side walls to prevent exposed copper.
Fully automated tape ring handling from standard cassettes, supporting up to 12 inches.
Utilizes an autocatalytic immersion Sn process.
Passes solderability tests according to JEDEC J-STD-002E.
Surpasses JEDEC standards with 8-hour steam aging and 16-hour bake tests at 155°C.

Immersion Tin Plating
Immersion Tin plating is used for full copper surfaces on singulated QFN/DFN packages with the new Meco WFL-20 tool.

Facility Requirements for Meco WFL-20

Footprint: 5.3 x 2.6 meters
Total electrical load: 58 kW
Average electrical load: 36 kW
Air consumption: 20 Nm³/h
DI water consumption: 400 l/h
Exhaust consumption: 600 Nm³/h

Catalog excerpts

Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool-1

Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool Future Proof Equipment Besi introduces an advanced solution for the Wettable Flank surface mount. A wettable flank is a specific design in which the mounting edge of an IC has a fillet that allows you to see and test that a proper connection has been made on a pad that is for the most part not visible once it is attached to a leadframe or board. This allows better inspection of packages such as QFNs Immersion Tin Solder fillet after assembly with AOI (Automated Optical Inspection). • Total solution, equipment with process solution from chemical partner Sytron. • Auto Catalytic Immersion Tin to ensure reliable AOI (Automated Optical Inspection) after board mounting of packages (no leadframe thickness limitation). • Lower cost alternative for step-cut or dimple to achieve wettable flanks (Best Cost of Ownership guarantee). • Fully covered cut side walls (no exposed Copper). • Fully automated Tape ring handling from standard cassettes (up to 12 inch). • Autocatalytic Immersion Sn process. • Passes solderability tests according JEDEC J-STD-002E. • Passes 8 hours steam aging test and 16 hour bake @ 155⁰C (surpasses Jedec standard)

Open the catalog to page 1

Wettable Flank Plating Immersion Tin plating for full Copper surface on singulated QFN / DFN packages with the new Meco WFL-20 tool-2

www.besi.com - [email protected] Facility requirements Total electrical load: Average electrical load: Exhaust consumption:

Open the catalog to page 2

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