Strip Mapping E142 on Die Bonder 2100 Get Ready for E-Dots©

Device Traceability Strip Identification • Able to read 2D DataMatrix down to 100 urn dots • Able to read CODE39 barcode down to 200 urn bars • Preferred StripID location: Near leading or trailing edge • SEMI E142 compliant strip mapping structure • E142.2 SECSII compliant communication • Configurable strip map down- and upload • BinCodeMap generation configurable • TransferMap generation configurable • Wafer mapping via Streaml 2 still available Strip Mapp SubstrateMap SubstrateType Strip Substrateld Overlay MapName DounloadBinCodeMap BinCodeMap BinType HexaBecimal NullBin □□ iDiDiDiaiaioioio...

Benefits Strip Identification • Only small StripID code area required • Barcode is sometimes very practicable and easier to attach • No mechanical contact with code area Get Ready for the Next Level of Inkless Production • Well known and widely spread standard • Works with the same SECS II host you already have • Customer to select names of map down- and uploads • Customer to select level of inkless strip marking (E-Dot©) • Linked wafer position to strip position for full single device traceability • No need to change a proven running system Customer System SECS II Communication E-Dot System...

To the limits. And beyond. Shaping Future Trends in Assembly and Packaging Esec has unique and extraordinary capabilities in the field of assembly and packaging. We continue to be the trend-setter in technology and in support of future advancements. And we will keep contributing to the positive development of the industry. This is where we differentiate ourselves and drive future growth. Our customers benefit from economical advantages provid­ d by our unique e technology and innovation concepts that are incorporated into our highly competitive products. Driving Innovation Strength As technology...