INVESTOR PRESENTATION
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INVESTOR PRESENTATION February 2019

Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking statements, which are found in various places throughout the press release, including, but not limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of words such as “anticipate”, “estimate”, “expect”, “can”, “intend”, “believes”, “may”, “plan”,...

IV. Financial Review and Summary

Besi Overview Corporate Profile Financial Highlights Investment Considerations • Leading assembly equipment supplier with #1 and #2 positions in key markets. 36% addressable market share • Broad portfolio: die attach, packaging and plating • Strategic positioning in substrate and wafer level packaging • Global operations in 6 countries; 1,759 employees. HQ in the Netherlands • LTM revenue and net income of € 525.3 and € 136.3 million • Cash/deposits at Q4-18: € 475.5 million • Net cash/deposits at Q4-18: € 199.4 million • € 608.4 million of dividends and share repurchases since 2011* •...

Product Strategy • • • • Expanded advanced packaging leadership into die attach area Gained market share organically and via acquisitions Gained mindshare with key industry leaders Growth in China, key customers and electronics supply chains Successful Execution of Strategic Plan Initiatives • Asian production transfer combined with European restructuring enhanced profit potential • Developed two key Asian production hubs (MY and CN), Singapore development/support center and Asian supply chain • Scalability enhanced. Break even revenue levels reduced Gross Margin (%) Financial Metrics •...

Best in Class Product Portfolio Die Attach • 2009 SSI • 2100 xP plus / hS plus / PPP plus • 2100 DS New • 2100 sD • 2100 sD advanced New • 2100 SC Flip Chip • 8800 CHAMEO advanced New • 8800 TCB advanced New • 8800 FC Quantum advanced New • 2100 FC hS New Multi Module Attach • 2200 evo • 2200 evo plus • 2200 evo hS New • Leadframe • MEMS • Sensors • Wafer • Panel • Singulation • Sorting In Development • Next generation Die Attach Plating • Leadframe • Film & Foil • Battery • Solar

Semiconductor Manufacturing Equipment (2018: $65.9B)* Semiconductor Assembly Process Dicing Die Attach Wire Bond Packaging** Plating * Source: VLSI January 2019 ** Includes Molding, Trim and Form and Singulation Systems Leadframe Assembly Substrate Wire Bond Assembly Substrate Flip Chip Assembly/TCB Wafer Level Packaging Flip Chip Assembly/Fan Out

Customer Ecosystem TOSHIBA OLUMILEDS QOrVO Renesas SONY -Wicron BOSCH A L • Diversified, blue chip customer base, top 10 = 54% of 2018 revenue • Leading IDMs and subcontractors. 68/32% split in 2018 • Also supply leading fabless companies: Qualcomm, Broadcom, MediaTek via subcontractors • Long term relationships, some exceeding 50 years

Chandler • • Sales Office • Production Site • Sales, Production and R&D Site m Duiven & Drunen, (The Netherlands) J 1 J Steinhause rland) Steinhausen, Radfeld,(Austria) (Switzerland) • Development activities in Europe • Production in Asia • Sales/service activities in Asia, US and Europe YTD December 31, 2018

Summary Historical Financials Year Ended December 31, (€ millions, except share data) (a) Adjusted for 2:1 stock split in May 2018 Step function revenue and gross margin development over four business cycles since 2006 • Addressable market share has expanded as well Strong profit and margin development: • Market position and efficiencies drive gross margin to 57% level in past two years • Operating initiatives keep expense growth in check • Sector leading net margins of 26% Net cash continues to expand: • Increased profits, scalable production model help drive net cash to € 199.4 million at...

Cumulative: € 608.4 MM of distributions since 2011* 209.5 ■ Dividends ■ Share Repurchases * Assumes proposed dividend payment of € 1.67 per share for approval at April 2019 AGM and share repurchases through February 18, 2019.

Market Profile Share Ownership 70% 60% 50% 40% 30% 20% 10% 0% Symbol/ Index Avg. Daily Volume (b) & Liquidity Top 10 Shareholders (c) (% of shares outstanding) 60% By Geography 2015 NL 2017 a) As of February 18, 2019; b) Shares adjusted for 2:1 stock split in May 2018; c) Besi estimates

Assembly Equipment Market Trends Assembly Equipment Market Market Size 2020E Source: VLSI December 2018 Besi Revenue Revenue • VLSI revised 2019 growth rate to -12.4% at start of year • H2-19 order rebound forecast as new product cycle begins. Renewed growth in 2020 February 2019

Assembly Equipment Market Composition Assembly Equipment Market * (2017: $4.6 billion) Other Assembly (Inspection, Dicing) 31.0% Besi Addressable Market * (2017: $1.8 billion) Lead Trim & Plating Form 1.5% 5.0% Molds 7.2% Die Sorting 4.1% Flip Chip 12.4% * Source: VLSI October 2018 • Roughly half of assembly market represented by die attach and packaging equipment • Die Attach represents Besi’s largest addressable market February 2019

Digital society Driven by new technologies - 5G - AI - big data - Robotics - Transportation - Environment - Health care Will need continuous new solutions - 1zb = 1,000,000,000 tb - 1zb= 1,000 data centres - 1zb = 180,000,000 homes (energy requirements) Source: IMEC ITF 2018 KB - MB - GB - TB - PB - EB - ZB - YB

Requiring Increased Density, Higher Accuracy and Smaller Form Factors for Next Generation Devices Front End Today => Tomorrow Transistor scaling Lithography New structures 3D Back End Assembly More contacts Smaller pitches Thinner/denser more complex packages Stacked structures 3D From simple Wire Bond to complex 3D structures with TSVs, microbumps and thin dies WLP/FOWLP packages to WLP/FOWLP packages without substrate interposer February 2019