*mydirectindustry

Fico MMS-LM Top Foil

Product catalog summary

Overview
The Fico MMS-LM Top Foil is a molding machine designed for encapsulating microchips in plastic. It supports single-sided packages on substrates up to 102 x 280 mm, optimizing board utilization and enabling bleed-free production of bare die molded underfill products.

Key Features

Substrate Compatibility: Handles substrates up to 102 x 280 mm.
Mold Design: Features individually moving bottom molds and a modular design.
Vacuum System: Includes board and cavity vacuum for void-free products, with V-pin vacuum control.
Molding Press: Offers top-edge molding for low viscosity compounds, adjustable clamping force, and dynamic clamping control.
Compatibility: Compatible with both automatic and manual machines, allowing for mold and process parameter exchange.

Technical Specifications

Machine Dimensions: 1210 x 1175 x 2012 mm, approx. 850 kg.
Leadframe Size: Width: 74 - 102 mm, Length: 100 - 280 mm, Thickness: 0.1 - 1.5 mm, Max height: 2 mm.
Supply Requirements: Voltage: 208 - 480 VAC, Frequency: 50/60 Hz, Power: 7.5 kVA, Compressed air: 5 - 10 bar.
Press & Mold: Max clamp force: 600 kN, Max mold opening: 90 mm, Max transfer pressure: 180 bar.

Applications
The MMS-LM Top Foil is suitable for various industries including optics, LED, medical, automotive, memory, electronics, and mobile substrates. It is ideal for developing and optimizing new products before large-scale production and can handle small production batches or offline cleaning of molds.

Additional Features

Built-in cleaning exhaust for easy maintenance.
Foil unit allows for bleed-free molding without the need for mold cleaning.

Catalog excerpts

Fico MMS-LM Top Foil Manual - Large Substrate - Top Foil Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. The MMS-LM Top Foil can handle all current single sided packages on up to 102 x 280 mm large substrates, which allow high board utilisation. Together with the sophisticated top foil molding feature, the MMS-LM allows bleed free production of bare die molded underfill products. Fico MMS-LM 102 x 280 mm substrates Individually moving bottom molds Modular mold design Conventional Moving blocks Complex handling Large and heavy mold The MMS-LM Top Foil is the perfect solution for molding process parameter optimization. Using the original molds, new products can be developed and optimized prior to large scale production. It can also be used for small production batches or offline cleaning of AMS-LM molds. FOIL UNIT MOLD MOLDING PRESS

Open the catalog to page 1

www.besi.com - [email protected] Vacuum • Board vacuum • Cavity vacuum • Void free end product • V-pin vacuum control • Suited for complex molded underfill packages Mold • Solid mold design • Laminated mold design • Vacuum mold • V-pin vacuum control • High precision Fico quality • Bare die molding • Bleed free molding • No mold cleaning necessary Molding Press • Topedge molding (low viscosity compounds) • Adjustable high clamping force • Dynamic Clamping Control (Flip Chip Bare Die) • 17 process patents • Board and cavity vacuum • Individual, equal board clamping • Fully compatible automatic and...

Open the catalog to page 2

Fico MMS-LM Top Foil

Fico MMS-LM Top Foil

Catalog excerpts

All BE Semiconductor Industries N.V. catalogs and technical brochures

Archived catalogs