Fico MMS-LM Top Foil Manual - Large Substrate - Top Foil Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. The MMS-LM Top Foil can handle all current single sided packages on up to 102 x 280 mm large substrates, which allow high board utilisation. Together with the sophisticated top foil molding feature, the MMS-LM allows bleed free production of bare die molded underfill products. Fico MMS-LM 102 x 280 mm substrates Individually moving bottom molds Modular mold design Conventional Moving blocks Complex handling Large and heavy mold The MMS-LM Top Foil is the perfect solution for molding process parameter optimization. Using the original molds, new products can be developed and optimized prior to large scale production. It can also be used for small production batches or offline cleaning of AMS-LM molds. FOIL UNIT MOLD MOLDING PRESS

www.besi.com - [email protected] Vacuum • Board vacuum • Cavity vacuum • Void free end product • V-pin vacuum control • Suited for complex molded underfill packages Mold • Solid mold design • Laminated mold design • Vacuum mold • V-pin vacuum control • High precision Fico quality • Bare die molding • Bleed free molding • No mold cleaning necessary Molding Press • Topedge molding (low viscosity compounds) • Adjustable high clamping force • Dynamic Clamping Control (Flip Chip Bare Die) • 17 process patents • Board and cavity vacuum • Individual, equal board clamping • Fully compatible automatic and...