Fico AMS-W The Art of Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Dedicated to the latest trend in single sided packages, the Fico AMS-W is the most economic and flexible molding system. It is the proven molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi array and stacked die. Fico AMS-W Individually moving blocks 35% less moving parts Modular mold design Low cost PR-set Conventional Rigid moving blocks Complex handling Large and heavy mold Expensive PR-set The Fico AMS-W has a high output, an exceptional performance and an extremely high yield. Together with the low cost of ownership of machine and product related set, the Fico AMS-W is the optimal solution to mold your package. CASSETTE HANDLER LEADFRAME HANDLER PELLET SUPPLY MOLDING PRESS

www.besi.com - [email protected] ■ Freely accessible ■ Slot to slot copy ■ Two or four deck version ■ High capacity (400 & 800 mm) ■ Bar code and RFID reader (optional) Vision ■ Leadframe orientation check ■ Mark inspection ■ Optical Character Verification (OCV) ■ Automatic orientation correction ■ Leadframe pre-heating ■ Anti warpage leadframe cooling ■ Air cushion transport ■ Topedge molding (low viscosity compounds) ■ Adjustable high clamping force ■ Dynamic Clamping Control (Flip Chip) ■ 17 process patents ■ Board and cavity vacuum ■ Individual, equal board clamping Machine Dimensions ■ WxDxH:...