Fico AMS-W The Art of Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Dedicated to the latest trend in single sided packages, the Fico AMS-W is the most economic and flexible molding system. It is the proven molding solution for products like QFN, BGA, BOC and BGA‑MAP, including high end applications such as flip chip, multi array and stacked die. • Individually moving blocks •• 35% less moving parts •• Modular mold design • Low cost PR-set Fico AMS-W • Rigid moving blocks •• Complex handling •• Large and heavy mold •• Expensive PR-set The AMS-W has a high output, an exceptional performance and an extremely high yield. Together with the low cost of ownership of machine and product related set, the AMS-W is the optimal solution to mold your package. Substrate MOLDING CASSETTE HANDLER LEADFRAME HANDLER PELLET SUPPLY MOLDING PRESS

Cassette Handler •• Freely accessible •• Slot to slot copy •• Two or four deck version •• High capacity (400 & 800 mm) •• Bar code and RFID reader (optional) •• Leadframe orientation check •• Mark inspection •• Optical Character Verification (OCV) Leadframe Handler •• Automatic orientation correction •• Leadframe pre-heating •• Anti warpage leadframe cooling •• Air cushion transport Pellet Supply •• Remote pellet feed (up to 40m) •• Pellet length check •• Pellet cooling •• Pellet age control Molding Press •• Topedge molding (low viscosity compounds) •• Adjustable high clamping force •• Dynamic...