Fico AMS-W Top Foil The Art of Top Foil Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Dedicated to the latest trend in single sided packages, the Fico AMS-W is the most economic and flexible foil molding system. It is the molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi array and stacked die. The special foil molding feature allows bleed free production of bare die molded underfill products. Fico AMS-W Individually moving blocks 35% less moving parts Modular mold design Low cost PR-set Conventional Moving blocks Complex handling Large and heavy mold Expensive PR-set CASSETTE HANDLER FOIL UNITS VISION PELLET SUPPLY LEADFRAME HANDLER MOLDING PRESS

www.besi.com - [email protected] Cassette Handler High capacity Freely accessible Slot to slot copy Two or four deck version Bar code and RFID reader (optional) Leadframe orientation check Mark inspection Optical Character Verification (OCV) Molding Press Leadframe Handler Topedge molding (no gold layer) Flash free molding Dynamic Clamping Control (DCC) 17 process patents Board and cavity vacuum Individual, equal board clamping Automatic orientation correction Leadframe pre-heating Anti warpage leadframe cooling Air cushion transport Pellet Supply Foil Units Remote pellet feed (up to 40 m) Pellet...