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Fico AMS-W Top Foil

Product catalog summary

Overview
The Fico AMS-W Top Foil is a state-of-the-art molding system designed for encapsulating microchips in plastic, specifically catering to single-sided packages such as QFN, BGA, BOC, and BGA-MAP. It supports advanced applications like flip chip, multi-array, and stacked die, offering a bleed-free production process for bare die molded underfill products.

Key Features

Future Proof Equipment: The system features individually moving blocks, reducing moving parts by 35%, and a modular mold design that lowers costs.
Molding Press: Includes top-edge molding, flash-free molding, and Dynamic Clamping Control (DCC) with 17 process patents.
Handling Systems: The cassette handler offers high capacity and accessibility, while the leadframe handler provides automatic orientation correction and pre-heating.
Foil Units: Enable bare die and bleed-free molding without the need for mold cleaning.
Pellet Supply: Features remote pellet feed, length check, cooling, and age control.

Technical Specifications

Machine Dimensions: 2273 x 1490 x 1976 mm, weighing approximately 2600 kg.
Leadframe Size: Width 45-79 mm, Length 180-280 mm, Thickness 0.1-1.5 mm, Max height 2 mm.
Supply Requirements: Voltage 208-480 VAC, Frequency 50/60 Hz, Power rating 9 kVA, Compressed air 5-10 bar.
Performance: Uptime 98%, MTBF > 200h, MTTR > 1h, MTTA < 3 min.
Press & Mold: Max clamp force 450 kN, Max mold opening 90 mm, Max transfer pressure 180 bar.

Applications
The Fico AMS-W is suitable for various sectors including optics, LED, medical, automotive, memory, electronics, mobile, substrate copper, ceramic film, and more.

Contact Information
For more details, visit Besi's website or contact them via email at [email protected].

Catalog excerpts

Fico AMS-W Top Foil The Art of Top Foil Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Dedicated to the latest trend in single sided packages, the Fico AMS-W is the most economic and flexible foil molding system. It is the molding solution for products like QFN, BGA, BOC and BGA-MAP, including high end applications such as flip chip, multi array and stacked die. The special foil molding feature allows bleed free production of bare die molded underfill products. Fico AMS-W Individually moving blocks 35% less moving parts Modular mold design Low cost PR-set Conventional Moving blocks Complex handling Large and heavy mold Expensive PR-set CASSETTE HANDLER FOIL UNITS VISION PELLET SUPPLY LEADFRAME HANDLER MOLDING PRESS

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www.besi.com - [email protected] Cassette Handler High capacity Freely accessible Slot to slot copy Two or four deck version Bar code and RFID reader (optional) Leadframe orientation check Mark inspection Optical Character Verification (OCV) Molding Press Leadframe Handler Topedge molding (no gold layer) Flash free molding Dynamic Clamping Control (DCC) 17 process patents Board and cavity vacuum Individual, equal board clamping Automatic orientation correction Leadframe pre-heating Anti warpage leadframe cooling Air cushion transport Pellet Supply Foil Units Remote pellet feed (up to 40 m) Pellet...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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