Fico AMS-W Top Foil The Art of Top Foil Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Dedicated to the latest trend in single sided packages, the Fico AMS-W is the most economic and flexible foil molding system. It is the molding solution for products like QFN, BGA, BOC and BGA‑MAP, including high end applications such as flip chip, multi array and stacked die. The special foil molding feature allows bleed free production of bare die molded underfill products. • Individually moving blocks •• 35% less moving parts •• Modular mold design • Low cost PR-set • Moving blocks •• Complex handling •• Large and heavy mold •• Expensive PR-set Fico AMS-W TOP FOIL MOLDING CASSETTE HANDLER LEADFRAME HANDLER FOIL UNITS PELLET SUPPLY MOLDING PRESS

Cassette Handler •• High capacity •• Freely accessible •• Slot to slot copy •• Two or four deck version •• Bar code and RFID reader (optional) •• Leadframe orientation check •• Mark inspection •• Optical Character Verification (OCV) Leadframe Handler •• Automatic orientation correction •• Leadframe pre-heating •• Anti warpage leadframe cooling •• Air cushion transport Molding Press •• Topedge molding (no gold layer) •• Flash free molding •• Dynamic Clamping Control (DCC) •• 17 process patents •• Board and cavity vacuum •• Individual, equal board clamping Foil Units •• Bare die molding •• Bleed...