Fico AMS-LM The Art of Large Substrate Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. In line with the market trend of larger substrates, Fico has introduced a new large substrate molding machine. The AMS-LM can handle substrates of up to 102 x 280 mm and can handle all current single sided packages. Large substrates allow a high board utilisation and in combination with the high output of the AMS-LM, performance and yield increase significantly. • 102 x 280 mm substrates • Individually moving blocks •• 35% less moving parts •• Modular mold design • Low cost PR-set • Moving blocks •• Complex handling •• Large and heavy mold •• Expensive PR-set Fico AMS-LM Large Substrate MOLDING CASSETTE HANDLER LEADFRAME HANDLER PELLET SUPPLY MOLDING PRESS

Cassette Handler •• High capacity •• Freely accessible •• Slot to slot copy •• Two or four deck version •• Bar code and RFID reader (optional) •• Leadframe orientation check •• Mark inspection •• Optical Character Verification (OCV) Leadframe Handler •• Automatic orientation correction •• Leadframe pre-heating •• Anti warpage leadframe cooling •• Air cushion transport Molding Press •• Large substrate molding •• Topedge molding (low viscosity compounds) •• Adjustable high clamping force •• Dynamic Clamping Control (Flip Chip Bare Die) •• 17 process patents •• Board and cavity vacuum •• Individual,...