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Fico AMS-LM Top Foil

Fico AMS-LM Top Foil
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Catalog excerpts

Fico AMS-LM Top Foil The Art of Large Mold Top Foil Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. In line with the market trend of larger substrates and exposed dies, Besi has introduced a new large-substrate top-foil molding machine. The AMS-LM Top Foil can handle substrates up to 102 x 280 mm and handles all current single sided packages. Large substrates allow a high board utilisation and in combination with the high output of the AMS-LM, performance and yield increase significantly. On top of that the special foil molding feature allows bleed free production of bare die molded underfill products. • Individually moving blocks •• 35% less moving parts •• Modular mold design • Low cost PR-set • Moving blocks •• Complex handling •• Large and heavy mold •• Expensive PR-set Fico AMS-LM Top Foil Large mold FOIL MOLDING CASSETTE HANDLER LEADFRAME HANDLER FOIL UNITS PELLET SUPPLY MOLDING PRESS

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Cassette Handler •• High capacity •• Freely accessible •• Slot to slot copy •• Two or four deck version •• Bar code and RFID reader (optional) •• Leadframe orientation check •• Mark inspection •• Optical Character Verification (OCV) Leadframe Handler •• Automatic orientation correction •• Leadframe pre-heating •• Anti warpage leadframe cooling •• Air cushion transport Foil Units •• Bare die molding •• Bleed free molding •• No mold cleaning necessary Pellet Supply •• Remote pellet feed (up to 40m) •• Pellet length check •• Pellet cooling •• Pellet age control Molding Press •• Topedge molding...

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